-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
USI Empowers Smart Cockpit System Innovation with Excellent Modular Design Capability
July 21, 2023 | USIEstimated reading time: 3 minutes

With the booming development of electric vehicles and advanced driver-assistance systems, the automotive industry is entering a rapidly evolving era of smart driving. To enhance performance and passenger experience, numerous automakers are actively incorporating cutting-edge electronic devices and technologies, striving to achieve more advanced driver's cockpit systems. In this flourishing field, USI is collaborating with multiple automotive SoC solution providers (TP) to accelerate the development of smart cockpit systems by leveraging its years of expertise in System-in-Package (SiP) and System-on-Module (SoM) modules, effectively reducing the size of automotive compute modules while ensuring the highest operational speed of DDR.
Modern smart cockpit systems have evolved beyond limited infotainment functions such as CD players, USB, and Bluetooth connectivity. They now encompass a wide range of rich features, including passenger entertainment displays, panoramic assistance displays, heads-up displays, digital instrument clusters, driver detection, passenger detection, voice-controlled temperature adjustment, voice-controlled music playback, and message transmission. These advancements allow drivers to experience a prestigious cockpit similar to that of an aircraft, greatly enhancing driving comfort, improving handling performance, and reducing driver fatigue.
Smart cockpit systems not only fulfill the role of a mobile personal entertainment center but also continuously innovate in line with the evolving trends of artificial intelligence (AI) assistance, advanced connectivity (C-V2X), advanced driver-assistance systems (ADAS), and software-defined vehicles (SDV). These trends will further drive the development of smart cockpit systems in the following application scenarios:
Intelligent Human-Machine Interface: Touchscreen interfaces have become the mainstream method of interaction today. However, in the future, with the gradual integration of artificial intelligence (AI) assistance, traditional physical touchscreens may gradually be replaced by advanced voice control, gesture control, and even eye-tracking control.
Diversified Cabin Functions: The future smart cockpit will integrate fully autonomous driving technology and become a versatile center for smart office and entertainment. Drivers and passengers will be able to engage in office work, meetings, multimedia entertainment, and other activities within the vehicle cabin.
Based on these development trends, it is evident that there will be a significant increase in market demand for System-on-Chips (SoCs) and active/passive electronic components. With the improvement in CPU processing speed and the expansion of functionalities, using traditional chip-on-board solutions would require mainboards to transition to high-density interconnect (HDI) PCBs with 10 or more layers. However, modular design can reduce motherboard PCB stack-up and design complexity.
USI adopts advanced underfill, BGA (Ball Grid Array) mounting, embedded passive components, and high-density SMT (Surface Mount Technology) process technology to develop automotive compute modules. These modules encompass crucial control components such as System-on-Chips (SoCs), dynamic random-access memory (DDR), and power management integrated circuits (PMICs), which are independent of the mainboard. This modular design reduces the mainboard's footprint and enhances computational performance, including processing speed and power distribution network performance, thereby improving the quality and efficiency of the smart cockpit system. Simultaneously, carmakers can focus on mainboard development, reducing overall development time and saving on research and development costs. Furthermore, the adoption of automotive compute modules can lower the mainboard's cost for manufacturers and facilitate the implementation of high-density PCB designs within smaller module areas.
USI has been dedicated to driving innovation in automotive technology and has extensive experience in the development of automotive compute module products. The company can provide a wide range of high-quality advanced automotive compute modules, delivering a safer, more convenient, and exciting driving experience for drivers and passengers of new-generation vehicles. USI's solutions not only offer comprehensive technical support to automotive manufacturers but also achieve improvements in product quality and performance, reduce development time, and lower research and development costs.
As the market for smart cockpit systems continues to evolve, USI will continue to lead the automotive industry into this new era, injecting strong momentum into the intelligent development of the future automotive industry.
Suggested Items
W. Gessmann Showcases Range of Innovative AMR-Solutions at LogiMAT 2025
03/05/2025 | W. Gessmann GmbHThe international trade fair LogiMAT opens its doors in Stuttgart in March 2025, showcasing innovations in intralogistics and process management. W. Gessmann GmbH will present cutting-edge solutions for the intelligent use of AMRs and cobots in industrial intralogistics and workshops at Stand 8D65.
Murata, Rohde & Schwarz jointly enhance power efficiency of 5G and 6G devices through Digital Envelope Tracking
03/05/2025 | MurataMurata Manufacturing is launching the world’s first Digital Envelope Tracking (Digital ET) technology. This advanced technology has the potential to considerably reduce power consumption of advanced RF circuits for 5G and future 6G devices, contributing towards more energy efficiency in various applications.
TASMIT Launches Large Glass Substrate Inspection System for Advanced Semiconductor Packaging
03/04/2025 | ACCESSWIRETASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA® series of semiconductor wafer visual inspection systems, which has gained attention for its high efficiency in advanced semiconductor manufacturing.
ITW EAE Electrovert Unveils Aquastorm 160 a Compact Design that Meets Unmatched Cleaning Performance
03/04/2025 | ITW EAEElectrovert, a leader in innovative cleaning solutions, proudly announces the launch of the Aquastorm 160 (AS160), an advanced cleaning system designed to deliver superior performance with a compact footprint.
RTX's Collins Aerospace EPACS Power and Thermal Management System Ready for Aircraft Integration
03/04/2025 | RTXCollins Aerospace, an RTX business, has successfully tested a fully functional demonstrator of its next-generation power and thermal management system (PTMS).