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Microchip Expands Space-Qualified FPGA Portfolio with New RT PolarFire® Device Qualifications and SoC Availability
July 10, 2025 | MicrochipEstimated reading time: 2 minutes
Continuing to support the evolving needs of space system developers, Microchip Technology has announced two new milestones for its Radiation-Tolerant (RT) PolarFire® technology: MIL-STD-883 Class B and QML Class Q qualification of the RT PolarFire RTPF500ZT FPGA and availability of engineering samples for the RT PolarFire System-on-Chip (SoC) FPGA. These achievements underscore the company’s more than 60 years of spaceflight heritage and its commitment to delivering highly reliable, low-power solutions for the most demanding space applications.
MIL-STD-883 Class B and Qualified Manufacturers List (QML) Class Q are industry standards that define rigorous testing and qualification processes for microelectronic components used in high-reliability applications, such as space and defense. MIL-STD-883, developed by the U.S. Department of Defense, outlines methods for environmental, mechanical and electrical testing to ensure device reliability under extreme conditions. QML Class Q, managed by the Defense Logistics Agency (DLA), certifies that manufacturers consistently produce components meeting these stringent requirements.
Unlike traditional SRAM-based FPGAs, RT PolarFire devices utilize nonvolatile technology, making them immune to configuration memory upsets caused by radiation. This eliminates the need for external mitigation measures, helping reduce system complexity and overall cost. RT PolarFire FPGAs consume up to 50% less power than mid-range SRAM-based alternatives, enabling satellite designers to optimize Size, Weight and Power (SWaP) without compromising mission-critical reliability. The PolarFire RTPF500ZT FPGA advances the family’s capabilities, offering enhanced Single Event Latch-up (SEL) radiation performance and increased robustness for inflight programming compared to the original RTPF500T.
"Microchip Technology has a proven track record of supporting critical space missions, spanning low Earth orbit, satellite platforms and deep space exploration," said Shakeel Peera, vice president of marketing and strategy for Microchip’s FPGA business unit. "Our commitment to stringent quality standards, compliance with international regulations and long-term product reliability has solidified Microchip’s reputation as a trusted provider of aerospace hardware. As the industry demands higher performance, increased logic density and robust security, we remain dedicated to innovating solutions that address the evolving needs of modern space systems."
Engineering samples of the RT PolarFire SoC FPGA further strengthen Microchip’s portfolio of space-qualified solutions. This SoC integrates a real-time, Linux®-capable, RISC-V®-based microprocessor subsystem with a flight-proven FPGA architecture, enabling both flexible software support and deterministic real-time performance. With a roadmap to QML Class V and Class Y, the RT PolarFire SoC FPGA is well suited for central satellite processing, avionics and payload control where high reliability is essential.
RT PolarFire devices are supported by the Libero® SoC Design Suite, a comprehensive IP library, reference designs and solution stacks tailored for space applications. RT PolarFire SoC FPGAs also integrate with Microchip’s Mi-V ecosystem for RISC-V development. Additionally, development kits and hardware platforms are available to facilitate rapid prototyping, hardware validation and system integration, enabling engineers to efficiently bring mission-critical space systems from concept to deployment.
Microchip’s latest milestones in radiation-tolerant FPGA technology reflect ongoing progress in addressing the stringent requirements of contemporary space missions. With a focus on continuous improvement and industry collaboration, the company is well positioned to support the next generation of satellite, avionics and deep space systems.
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Honeywell-Led Consortium Receives UK Government Funding to Revolutionize Aerospace Manufacturing
09/02/2025 | HoneywellA consortium led by Honeywell has received UK Government funding for a project that aims to revolutionize how critical aerospace technologies are manufactured in the UK through the use of AI and additive manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Boeing-built X-37B Spaceplane Launches, Beginning Eighth Mission
08/26/2025 | BoeingThe Boeing-built X 37B Orbital Test Vehicle launched its eighth mission, lifting off aboard a SpaceX Falcon 9 from Kennedy Space Center, Florida. The vehicle is healthy on orbit and proceeding with standard checkout.
TI Semiconductors Enable Advanced Earth-observation Capabilities of ISRO’s First-of-its-kind NISAR Mission
08/25/2025 | Texas InstrumentsTexas Instruments (TI) semiconductors are enabling the radar imaging and scientific exploration payloads for the NASA-Indian Space Research Organization (ISRO) synthetic aperture radar (NISAR) satellite, which was recently launched into orbit.
Rocket Lab Announces Expanded U.S. Investments for National Security Programs and Semiconductor Manufacturing
08/25/2025 | BUSINESS WIRERocket Lab Corporation, a global leader in launch services and space systems, announced it is boosting its U.S. investments to expand semiconductor manufacturing capacity and provide supply chain security for space-grade solar cells and electro-optical sensors for national security space missions.