Defense Speak Interpreted: JADC2—Why It’s More Relevant Than Ever in Drone Warfare
Beyond the Board: Orbital High Ground—Why Space Superiority Is Slipping Away
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology
May 24, 2023 | Heraeus ElectronicsEstimated reading time: 1 minute
Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany. The agreement allows Heraeus Electronics to access a valuable patent portfolio from Bosch to accelerate the development of their inorganic potting compound, CemPack®, for encapsulation of power modules.
“The combination of expertise between Heraeus and Bosch enables a new type of encapsulants that will bring power electronic packages to the next level so that these packages can unfold the full potential of a new generation of semiconductors,” said Dr. Klemens Brunner, Head of Heraeus Electronics.
The encapsulation material offers superior thermal conductivity (>5 W/m/K) and extreme temperature resistance (up to 300°C), enabling increased power densities and improved reliability. The license agreement also allows the extension of the application spectrum to encapsulation of passive components (magnetics, capacitors, or resistors), electric motors (stators), or other devices where a thermal bridge to a heat sink is required while ensuring protection against the environment.
“Collaborations like these show the importance of open innovation to speed up development cycles and it is a great example for the innovation power of Heraeus,” said Michael Jörger, Head of Business Line Power Electronic Materials at Heraeus Electronics.
“We are excited to share our knowledge and IP of this new technology with Heraeus to deliver inorganic potting compounds meeting the highest standards of performance and reliability. Like Bosch, Heraeus is committed to excellence and has a reputation of shaping the market with innovative products,” said Dr. Peter Wolfangel, EVP Corporate Sector Research and Advance Engineering at Bosch.
The agreement is significant given the increasing demand for power modules as key components of the transition towards electrification. With its existing material portfolio for packaging and interconnection of semiconducting power dies, Heraeus Electronics already offers cutting-edge solutions for power electronics such as sinter paste, DTS, and Ag-free AMB.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Dupont De Nemours, Qnity Electronics Announce Pricing of Senior Secured Notes and Senior Notes
08/13/2025 | PRNewswireDuPont de Nemours, Inc. and Qnity Electronics, Inc. announced that Qnity priced an offering of $1.0 billion aggregate principal amount of 5.750% senior secured notes due 2032 and $750.0 million aggregate principal amount of 6.250% senior notes due 2033.
Agile Circuit Technology Group Unveils Leadership Team
08/13/2025 | Agile Circuit Technology GroupIn a transformative step for UK based Contract Electronics manufacturing, Agile Circuit Technology Group announces a new leadership team, forging a future of innovation, agility, and customer excellence.
Global Contract Manufacturing Market on Track for $968.7 Billion by 2030
08/13/2025 | PRNewswireAccording to the latest study from BCC Research, the "Contract Manufacturing: Global Markets to 2030" is projected to grow from $686.4 billion in 2025 to $968.7 billion by the end of 2030, at a compound annual growth rate (CAGR) of 7.1% during the forecast period of 2025 to 2030.
AI to Dominate Demand in 2025, While the Electronics Industry Faces Slow Growth in 2026
08/13/2025 | TrendForceTrendForce’s latest investigations find that the global electronics market in 2025 will be sharply divided. AI server demand—driven by data center consumption—will stand out as the sole growth engine, while end products such as smartphones, notebooks, wearables, and TVs are expected to stagnate under the combined pressures of high inflation, a lack of breakthrough innovations, and ongoing geopolitical uncertainty.
Federal Electronics Elevates Hermosillo Facility with Advanced Mycronic 3D AOI System
08/12/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has enhanced its new production line at its Hermosillo, Mexico facility with the addition of the Mycronic MYPro i50 Automated Optical Inspection (AOI) system.