Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Building Electronics Excellence in India

09/08/2025 | Nolan Johnson, SMT007 Magazine
Over two decades, Dave Bergman has helped steer the Global Electronics Association’s work in India, from a single training course to a thriving regional operation with deep government and industry ties. In this interview, Dave explains how the group went from partnering with IPCA to opening its own office in 2010, creating India’s first domestic electronics manufacturing standard, and securing funding for dozens of Indian companies to attend U.S. trade shows.

American Standard to Participate in European Microwave Week 2025

09/05/2025 | American Standard Circuits
Anaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.

HDI PCB Market Poised for Explosive Growth, Projected to Hit $34.23 Billion by 2032

09/04/2025 | Globe Newswire
According to Coherent Market Insights (CMI), the global HDI PCB market size is projected to expand at a CAGR of 8.3% over the forecast period, reaching USD 19.59 Bn in 2025 and USD 34.23 Bn by 2032.

New Podcast Episode Drop: MKS’ Atotech’s Role in Optimize the Interconnect

09/04/2025 | I-Connect007
In this episode of On the Line With…, host Nolan Johnson sits down with Patrick Brooks, MKS' Atotech's Global Product Director, EL Systems, to discuss the critical role that wet processes play alongside laser systems in advancing the Optimize the InterconnectSM initiative. Brooks points to Bondfilm as a key example—a specialized coating that enables CO₂ lasers to ablate more effectively than ever before.

UHDI Fundamentals: UHDI Technology and Industry 4.0

09/03/2025 | Anaya Vardya, American Standard Circuits
Ultra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in