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IPC President’s Award: Xaver Feiner

04/17/2025 | Nolan Johnson, SMT007 Magazine
Throughout his career, Xaver Feiner, vice president of marketing and sales at Zollner Elektronik, has developed extensive expertise in account management and new business development with a strong focus on the semiconductor industry, aerospace, and industrial electronics. Xaver has cultivated a profound understanding of global markets and remains deeply engaged with the challenges and opportunities presented by digital transformation. Since 2020, he has been an active member of the IPC Europe Advocacy Group, where he is dedicated to advancing the position of the electronics industry and the EMS sector across Europe.

Safran Inaugurates Advanced Manufacturing and Engineering Hub in Colorado to Propel Innovation in Satellite Propulsion

04/17/2025 | PRNewswire
Joe Bogosian, CEO of Safran Defense & Space, Inc. (Safran DSI), and Pier Roviera, President of Space Solutions at Safran DSI, inaugurated the company's new manufacturing facility in Parker, Colorado, on April 11.

IPC APEX EXPO 2025 Review: The New Normal Looks Like the Old Normal

04/16/2025 | Nolan Johnson, SMT007 Magazine
At IPC APEX EXPO, my days are filled with either talking or listening from sunup to sundown. I get to answer questions of some of the brightest minds in the business, while also listening and synthesizing what they’re sharing with me about the current and future state of the industry. Here are five observations based on the conversations.

INEMI Announces Board of Directors Election Results

04/16/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.

Elephantech: For a Greener Tomorrow

04/16/2025 | Marcy LaRont, PCB007 Magazine
Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
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