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SMTA Announces Program for 2025 Ultra High Density Interconnect (UHDI) Symposium

11/26/2024 | SMTA
The SMTA is excited to announce the technical program for the 2nd annual Ultra High Density Interconnect Symposium which takes place on January 23, 2025 in Peoria, Arizona, USA.

Siemens Extends Veloce with Innexis Shift-Left Software

11/07/2024 | Siemens
Siemens Digital Industries Software announced the Innexis product suite, a complement to its industry leading Veloce™ hardware-assisted verification and validation system.

Designers Notebook: Implementing HDI and UHDI Circuit Board Technology

10/23/2024 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.

Absolute EMS Expands Capabilities to Support the AI Industry with High-Complexity, High-Reliability PCB Assembly Services

10/08/2024 | Absolute EMS, Inc.
Absolute EMS, Inc., a four-time award-winning EMS provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), is proud to announce its enhanced printed circuit board assembly (PCBA) capabilities tailored to the fast-growing artificial intelligence

Foxconn Inaugurates Residential Housing Complex In Industrial Park In India

08/20/2024 | Foxconn
Foxconn and the state government of Tamil Nadu in India today inaugurated a new residential complex in Vallam Vadagal Industrial Park. The complex provides a sustainable living community for thousands of employees of the world’s largest manufacturing service provider.  
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