Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
BTU to Launch New iRaptor Profiling Technology at APEX 2023
December 13, 2022 | BTU International, Inc.Estimated reading time: Less than a minute
BTU International, Inc., a leading supplier of advanced thermal processing equipment for the electronics manufacturing market, is excited to announce the launch of its new profiling technology at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. As a result of the company’s strategic partnership with iRaptor, BTU has developed its new iRaptor Profiling Technology that will debut for the first time at the show in Booth #2322.
Customers have been increasingly concerned with process traceability and BTU is responding with its newest software solution. With iRaptor’s decades of experience and expertise in thermal profiling solutions, BTU now offers a differentiated technology to their customers for profiling ovens.
BTU has developed an OEM thermal profiler for its reflow ovens, powered by iRaptor technology. The new profiler provides end customers with a complete reflow solution that now includes the ability to verify profiles. Additionally, it eliminates the need to integrate third party products for verification of the reflow process.
BTU offers full training, support and warranty for the new profiling system.
Share on:
Suggested Items
Indium Experts to Present on Power Electronics at PCIM Europe 2025
04/17/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly and e-Mobility industries, Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, May 6-8, in Nuremberg, Germany.
Real Time with... IPC APEX EXPO 2025: Emerging Trends in Design and Technology
04/16/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy speaks with IPC design instructor Kris Moyer to discuss emerging design trends. They cover UHDI technology, 3D printing, and optical data transmission, emphasizing the importance of a skilled workforce. The role of AI in design is highlighted, along with the need for understanding physics and mechanics as designs become more complex. The conversation concludes with a focus on enhancing math skills for better signal integrity.
INEMI Announces Board of Directors Election Results
04/16/2025 | iNEMIThe International Electronics Manufacturing Initiative (INEMI) has announced results from its recent Board of Directors election. The consortium’s members have added one new director and re-elected four incumbents.
Nortech Expands Fiber Optic Capabilities to Include MT Connectors, Strengthening Aerospace and Defense Solutions
04/16/2025 | BUSINESS WIRENortech Systems, a trusted leader in innovative connectivity solutions, announced an exciting expansion in its fiber optic capabilities with the integration of MT connectors. MT connectors, known for their ability to support multiple fiber terminations in a compact form factor, are an ideal choice for applications requiring robust data transmission and reliability.
Elephantech: For a Greener Tomorrow
04/16/2025 | Marcy LaRont, PCB007 MagazineNobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.