Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Transition Automation Introduces New Permalex S Series
December 8, 2022 | Transition Automation, Inc.Estimated reading time: 1 minute
Transition Automation, Inc. announces an expanded Permalex product line, with the introduction of the S series. This new product line is specifically designed for aqueous solder paste formulations, which have aggressive chemistries that are not compatible with the standard E series (Blue Spring Steel) version.
This new series is developed from a high grade of stainless steel that is harder than the stainless steel often used for stencils and squeegees. This product is ground sharp – polished at the edge – and coated with the Permalex Teflon metal matrix.
“We maintain all the aspects that make Permalex products highly durable for mission critical SMT printing. This way, customers are getting a nearly identical product, except this version can be used in highly alkaline paste chemistries as well as in high humidity and tropical environments,” states Mark Curtin, Technical Support Manager for Transition Automation.
The product shares many of the high-reliability aspects as the standard Permalex E series, including precision grind-polish-coat, laser part number and date code marking, and hermetically sealed, clean dust-free packaging. To order the Permalex S series, customers may simply change the common product code “E” (or “W”) to “S”.
Permalex S series is a stainless steel, high hardness and high yield strength alternative to Permalex E and is available immediately for any SMT printer platform. Permalex S may be ordered with Universal Holder Assemblies or as bare replacement blades, or blades with holes, and/or with bends for intrusive printing.
Share on:
Suggested Items
Driving Innovation: Direct Imaging vs. Conventional Exposure
07/01/2025 | Simon Khesin -- Column: Driving InnovationMy first camera used Kodak film. I even experimented with developing photos in the bathroom, though I usually dropped the film off at a Kodak center and received the prints two weeks later, only to discover that some images were out of focus or poorly framed. Today, every smartphone contains a high-quality camera capable of producing stunning images instantly.
Hands-On Demos Now Available for Apollo Seiko’s EF and AF Selective Soldering Lines
06/30/2025 | Apollo SeikoApollo Seiko, a leading innovator in soldering technology, is excited to spotlight its expanded lineup of EF and AF Series Selective Soldering Systems, now available for live demonstrations in its newly dedicated demo room.
Indium Corporation Expert to Present on Automotive and Industrial Solder Bonding Solutions at Global Electronics Association Workshop
06/26/2025 | IndiumIndium Corporation Principal Engineer, Advanced Materials, Andy Mackie, Ph.D., MSc, will deliver a technical presentation on innovative solder bonding solutions for automotive and industrial applications at the Global Electronics A
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
06/26/2025 | Team NCAB -- Column: Fresh PCB ConceptsMicro components have redefined what is possible in PCB design. With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before. While these advancements support miniaturization and functionality, they introduce new assembly challenges, particularly with traditional solder mask and legend application processes.
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.