Naprotek Continues to Invest in Technology with BTU PYRAMAX
September 1, 2022 | Naprotek LLCEstimated reading time: 1 minute
Naprotek, LLC., a leading provider of high-reliability, quick-turn electronics manufacturing, has purchased a BTU PYRAMAX reflow oven to provide customers with the most cutting-edge solutions.
"BTU has a well-deserved reputation in the industry for high reliability and providing uniform profiles,” commented Larry Morrissey, Senior VP/GM, Naprotek. “The PYRAMAX is designed to have minimal downtime with its flux management and hassle-free maintenance. The lifetime warranty on the heaters and blowers are a testament to their dependability and have earned the respect of many process engineers. The heating design provides consistent zone-to-zone transition with a negligible delta in temperature setting. This design allows the profiling to be consistent in providing optimal solder joint quality.”
When it comes to reflow solutions, BTU’s PYRAMAX is known worldwide as the performance leader. With closed-loop convection control, the PYRAMAX reflow oven offers the utmost in process repeatability, board-to-board, oven-to-oven and line-to-line.
“BTU is known for its strong customer-centric service support that always is accommodating and with technical support that matches the needs of the most demanding engineers,” added Morrissey.
Naprotek has rapidly expanded to include both West and East Coast operations in California and New Hampshire, respectively. Naprotek is committed to delivering customer value through engineering, supply chain management, and manufacturing support.
BTU International has been the technology leader in the field of thermal processes equipment since 1950 and offers solutions with low operating costs and excellent thermal performance. PYRAMAX reflow ovens beat the competition in thermal uniformity, repeatability and exit temperature – even at higher throughput – and are suitable for processing heavy or complex circuit boards.
Suggested Items
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Indium Corporation to Showcase Precision Gold Solder Solutions at MEDevice Silicon Valley 2024
11/18/2024 | Indium CorporationIndium Corporation® will feature its high-reliability AuLTRA® MediPro gold solder solutions at MEDevice Silicon Valley, taking place on November 20-21 in Silicon Valley, California. AuLTRA® MediPro is a family of high-performance, precision gold solder solutions for critical medical applications.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum
11/14/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
Rehm Thermal Systems Mexico Wins the Mexico Technology Award 2024 in the Category Convection Soldering
11/13/2024 | Rehm Thermal SystemsRehm Thermal Systems Mexico has won the Mexico Technology Award in the category convection soldering with the patented mechatronic curtain for convection soldering systems.