DuPont Opens New Kapton, Pyralux Production Line in Circleville, Ohio
May 9, 2022 | DuPontEstimated reading time: 1 minute
DuPont Interconnect Solutions, a business within the Electronics & Industrial segment, held a ribbon-cutting ceremony with elected officials and business leaders to formally mark the completion of its $250 million capital project to expand production of Kapton polyimide film and Pyralux flexible circuit materials at the Circleville manufacturing site.
“The opening of the production line in Circleville marks a major milestone for DuPont and Electronics & Industrial,” said Jon Kemp, president of DuPont Electronics & Industrial. “The Kapton and Pyralux expansion will help ensure supply of innovative materials to meet the growing global customer demand in the automotive, consumer electronics, telecommunications, specialized industrial and defense segments. It also demonstrates our ongoing commitment to being the partner of choice for our customers and delivering them new products with higher reliability and supply assurance.”
DuPont employs more than 1,000 people across eight locations in Ohio, including 500 people at its site in Circleville. Kemp said, “DuPont is proud to play an integral role in Ohio’s plans to expand its semiconductor and electronics manufacturing ecosystem.”
This new manufacturing line uses DuPont proprietary processing capabilities to produce advanced Kapton polyimide films, which have set industry standards for more than 50 years, offering high performance, reliability and durability. Kapton polyimide films offer a unique combination of electrical, thermal, chemical and mechanical properties that withstand extreme temperature, vibration and other demanding environments.
Kapton polyimide film is also at the heart of DuPont’s Pyralux line of flexible copper-clad laminates that are available in a wide variety of copper types, thicknesses and construction options, all of which offer excellent thermal, chemical, electrical and mechanical properties. Pyralux laminates are ideal for use in a wide variety of multi-layer flex and rigid-flex applications which require advanced performance, such as low dissipation loss for high speed, high frequency, robust thermal resistance and high reliability.
Suggested Items
Incap Estonia Recognized with Second Golden Label for Responsible Business
06/27/2025 | IncapIncap Electronics Estonia has been awarded a golden label by the Responsible Business Forum in Estonia for the second time. The responsible business label is a prestigious symbol in Estonia that identifies entrepreneurs and organisations that demonstrate excellence in environmental, social, and economic responsibility.
TRI Unveils New Multi-Camera AOI, TR7500 SIII Ultra
06/27/2025 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, proudly introduces the new TR7500 SIII Ultra.
TT Electronics Achieves ISO 13485 Medical Certification at Mexicali EMS Facility
06/27/2025 | TT ElectronicsThis milestone underscores TT Electronics’ commitment to delivering high-quality, compliant, and reliable manufacturing solutions to its global customers in healthcare and life sciences.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
Scanfil Strengthens its Customer Portfolio in Medtech & Life Science by Signing Agreement with Liquid Instruments
06/27/2025 | BUSINESS WIREScanfil and Liquid Instruments have signed a manufacturing outsourcing agreement for Scanfil’s Melbourne plant in Australia. This agreement supports Liquid Instruments’ strategy to onshore production of its flagship Moku platform, strengthening domestic supply chains and bringing manufacturing closer to its research and development hub.