Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs

05/15/2025 | TrendForce
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.

DuPont to Introduce Advanced Kalrez Sealing Innovations for Semiconductor Manufacturing at SEMICON Southeast Asia

05/15/2025 | DuPont
DuPont is excited to announce its participation in SEMICON Southeast Asia (SEMICON SEA), taking place May 20-22, 2025, in Singapore. At booth L3105,

Koh Young Installs 24,000th Inspection System at Top 20 EMS

05/14/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.

New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions

05/14/2025 | I-Connect007
In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.

Siemens Leverages AI to Close Industry’s IC Verification Productivity Gap in New Questa One Smart Verification Solution

05/13/2025 | Siemens
Siemens Digital Industries Software announced the Questa™ One smart verification software portfolio, combining connectivity, a data driven approach and scalability with AI to push the boundaries of the Integrated Circuit (IC) verification process and make engineering teams more productive.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in