Excellon Installs COBRA-II Hybrid Laser System at TCLAD, Inc.
March 8, 2022 | ExcellonEstimated reading time: 1 minute

Excellon announces the installation of a COBRA-II Hybrid Laser System by TCLAD, Inc. of Prescott, Wisconsin. The Excellon COBRA-II Hybrid Laser System offers both UV and CO2 (IR) laser sources on a single platform. A large work area offers added capability for those companies running high-density prototypes and production PCBs.
Acquiring the Excellon COBRA-II laser adds yet another addition to our lineup of state-of-the-art circuit processing equipment at our Prescott Wisconsin facility. Over the years we have found the accuracy and speed of the Excellon COBRA lasers to be impressive, the new COBRA-II laser is no exception. We are seeing greatly reduced throughput time with excellent tolerance capability. This allowed us to reduce lead times and better meet the demanding dimensional challenges of our customer requirements. (Steve Taylor, Director of Technical Support, Global BDM)
TCLAD Inc., a Polytronics related company, formerly BERGQUIST Thermal Clad Division, Located in Prescott, Wisconsin, since 1997. For over 50 years, Bergquist products have been the world’s most trusted thermal management materials. Multi-award-winning formulations in various mediums provide essential heat dissipation for applications within numerous markets including automotive, consumer, telecom/datacom, power and industrial automation, computing, communication and many others.
Mike Sparidaens, Vice President of Sales, shared his comments: "The enhanced capabilities of the COBRA-II Hybrid Laser System go well beyond that of TCLAD’s older generation COBRA, and will yield premium quality results for their application. The Cobra II can handle the most challenging rigid and flexible circuit board designs. The system is well known worldwide for its reliability and capability. We are excited to have this second system installed at TCLAD’s facility."
Suggested Items
AI Chips for the Data Center and Cloud Market Will Exceed US$400 Billion by 2030
05/09/2025 | IDTechExBy 2030, the new report "AI Chips for Data Centers and Cloud 2025-2035: Technologies, Market, Forecasts" from market intelligence firm IDTechEx forecasts that the deployment of AI data centers, commercialization of AI, and the increasing performance requirements from large AI models will perpetuate the already soaring market size of AI chips to over US$400 billion.
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
OSI Systems Receives $36 Million Contract for Aviation Security Systems
05/08/2025 | BUSINESS WIREOSI Systems, Inc. announced that its Security division received a contract award for approximately $36 million to deploy and service airport screening solutions for a prominent international airport in the Middle East.
Cadence Unveils Millennium M2000 Supercomputer with NVIDIA Blackwell Systems
05/08/2025 | Cadence Design SystemsAt its annual flagship user event, CadenceLIVE Silicon Valley 2025, Cadence announced a major expansion of its Cadence® Millennium™ Enterprise Platform with the introduction of the new Millennium M2000 Supercomputer featuring NVIDIA Blackwell systems, which delivers AI-accelerated simulation at unprecedented speed and scale across engineering and drug design workloads.
Indium’s Karthik Vijay to Present on Dual Alloy Solder Paste Systems at SMTA’s Electronics in Harsh Environments Conference
05/06/2025 | Indium CorporationIndium Corporation Technical Manager, Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation on dual alloy solder paste systems at SMTA’s Electronics in Harsh Environments Conference, May 20-22 in Amsterdam, Netherlands.