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Materials and Manufacturing for the AI Era: The Next PCB Frontier

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AI is pushing hardware to its limits, and the bottleneck isn’t design anymore—it’s materials. Next-generation AI servers aren’t just heavier on layer counts. They demand better materials to handle the speed, heat, and signal integrity requirements of 400G, 800G, and even 1.6T Ethernet systems. Many server motherboards are already 32–36 layers. For the next wave of 1.6T-capable boards,  expect 40–50 layers, which must maintain high-frequency performance without degrading signal quality.

Nvidia’s PCB Vendor Victory Giant Plans to Raise Funds in Hong Kong IPO

08/07/2025 | I-Connect007 Editorial Team
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Filbert Arzola is a principal electrical engineer at Raytheon SAS and an instructor who teaches one of the few classes (that I know of) that focuses on setting design constraints. I asked Fil to share his thoughts on design constraints: the factors involved, the various trade-offs, and his best practices for optimizing constraints for your particular design. As Fil says, “Everything about a PCB is a constraint.”

Inside the AI Hardware Boom: Servers, Substrates and Advanced Packaging

08/07/2025 | Edy Yu, Printed Circuit Information, China, and Marcy LaRont, I-Connect007
AI is rewriting the hardware playbook, marrying complex software and algorithms to run and improve machine and equipment operations. Sorting through, managing, and utilizing massive amounts of data takes tremendous data storage and processing power. Enter the new generation of supercomputers and data servers. The data servers being built today are not your momma’s server, as they say.

Summer Vacation at AT&S: Welcome to World of Experience

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Welcome to the cool world of microelectronics. At AT&S, high-quality IC substrates and printed circuit boards are produced for prominent customers from the high-tech world, which have essential functions in smartphones, smartwatches and laptops and are also indispensable in airplanes, electric cars, satellites and many applications of digital life.
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