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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
December 10, 2021 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Right now, it seems that almost everyone I know is talking about the future. Doesn’t matter whether it’s with my family, loved ones, friends, industry colleagues, or neighbors I meet on the street, conversations are almost entirely forward-looking. This being the holiday season, some reminiscing is to be expected, but I’m just not hearing it in the chatter all around me–this year is different somehow. And it shows in this edition of my must-reads for the week as well.
This week we bring you forward-looking discussions with Dr. John Mitchell, IPC president and CEO, on IPC APEX EXPO and what to expect in the future; and an interview with Isola’s CEO, Travis Kelly, introducing a new industry consortium, the Printed Circuit Board Association of America. Innovative additive technologies gain the spotlight as well, with Nano Dimension and a combination of Averatek and American Standard Circuits leading this week’s news cycle. Wrapping up the theme is Siemens’ position as a visionary in the Industrial IoT Magic Quadrant, as compiled by Gartner.
The Mission of the New Printed Circuit Board Association of America
Published December 9
Barry Matties recently met with Travis Kelly to discuss the formation of the Printed Circuit Board Association of America (PCBAA), a consortium of U.S.-based companies he chairs to support U.S. domestic production of PCBs. PCBAA was established on three pillars, and Travis explains how they intertwine with each other—and with other similar organizations in the industry. This is an important read no matter what sector of the industry you fall in.
John Mitchell: Focus on the Future
Published December 6
In a far-ranging interview, first published in I-Connect007’s December issue of SMT007 Magazine, Dr. John Mitchell and Barry Matties discuss the upcoming IPC APEX EXPO, IPC programs, and the challenges–and opportunities–facing our industry. If you think Dr. Mitchell's assessment would be pessimistic, you'd be wrong.
Nano Dimension Sells Two DragonFly IV 3D-AME Systems to Defense and Government Agencies
Published December 6
Nano Dimension announced that it has sold the first two DragonFly IV 3D-AME printers, in addition to the two machines that have completed beta sites processes with other leading customers. DragonFly IV is an additive manufacturing system for fabrication of electronic devices which deposits materials while concurrently integrating capacitors, antennas, coils, transformers, and electro-mechanical components.
Siemens Positioned in Visionaries Quadrant of Gartner Magic Quadrant for Industrial IoT Platforms
Published December 7
Siemens Digital Industries Software announced it has been positioned by Gartner in the Visionaries Quadrant of the Gartner Magic Quadrant for Industrial IoT platforms. Siemens is positioned as the sole vendor in the “Visionaries” Quadrant in the report on its first participation in the research. Gartner describes Visionaries in a market as the innovators that drive the market forward by responding to emerging, leading-edge customer demands and by offering new opportunities to excel.
American Standard Circuits Utilizes Averatek Process for Medical Technology
Published December 6
CEO Anaya Vardya discusses the addition of the Averatek A-SAP™ to ASC’s offerings. In the news item, Vardya explains, “Our medical electronics customers depend on us to provide them with the most reliable PCBs possible. When dealing with medical products it is not hyperbole to say that it is always a matter of life or death. With the A-SAP manufacturing process ASC can now provide our customers with ultra high-density technology, 25 micron trace and space, and improved reliability, reducing layer counts and micro via lamination cycles, ultimately simplifying the design.”
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The Journey from Dilution to Zero Liquid Discharge
05/11/2026 | Richard Nichols, GreenSource EngineeringIf you’re familiar with the PCB industry, and a little long in the tooth like me, you may remember the cry, “The water board is here!” (or an equivalent authority). This was the signal for a frantic but regularly rehearsed exercise to turn on all the rinses. This anecdote demonstrates that in the early days of PCB production, prevailing practices revolved around a “dilution is the solution” mentality, in which manufacturers used copious amounts of water to dilute contaminants before discharging them into regulated municipal wastewater systems or natural water bodies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/08/2026 | Marcy LaRont, I-Connect007This week, I’ve selected some outstanding interviews that you’ll want to take note of. First, is a roundtable discussion featuring three dynamic industry cybersecurity experts. Please watch this important discussion that affects us all. Following that, I spotlight the IPC-2581 Consortium, which explains why IPC-2581 is the standard to replace Gerber data for manufacturing. Next, I am including my interview with PCBAA and AAM, who collaborated to release a short documentary on U.S. PCB manufacturing.
Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
Meet Emerging Engineers: Patrick Owen and Eric Mickenbecker, Summit Interconnect
05/05/2026 | Michelle Te, I-Connect007Patrick Owen and Eric Mickenbecker both work for Summit Interconnect, and are in their second year of the Global Electronics Association’s Emerging Engineer Program with mentor Brian Chislea. They stopped by the I-Connect007 booth at APEX EXPO and shared a bit of their story with me. Patrick has worked at the Hollister, California, plant since 2018, while Eric has been at the Chicago site since 2023. Like many of their peers, they came to the electronics industry from different paths, but are both excited about making an impact.