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Breaking Silos with Intelligence: Connectivity of Component-level Data Across the SMT Line

06/09/2025 | Dr. Eyal Weiss, Cybord
As the complexity and demands of electronics manufacturing continue to rise, the smart factory is no longer a distant vision; it has become a necessity. While machine connectivity and line-level data integration have gained traction in recent years, one of the most overlooked opportunities lies in the component itself. Specifically, in the data captured just milliseconds before a component is placed onto the PCB, which often goes unexamined and is permanently lost once reflow begins.

Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities

06/06/2025 | Zhen Ding Technology
On May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.

BAE Systems Unveils Comprehensive Line of M-Code GPS Receivers at Joint Navigation Conference

06/04/2025 | PRNewswire
BAE Systems unveiled a diverse line of M-Code Global Positioning System (GPS) receiver solutions at the Joint Navigation Conference in Cincinnati this week, rounding out an extensive line of products that ensure U.S. warfighters have the most dependable GPS systems available across sea, land, and air.

Rehm Thermal Systems Mexico: Ten Years of Growth and Innovation in an Emerging Market

06/03/2025 | Rehm Thermal Systems
Over ten years ago, Luis A. Garcia began his success story at Rehm Thermal Systems. On May 15, 2013, he initially joined as a member of the Rehm USA team.

Indium Joins Virginia Tech Center for Power Electronics Systems Industry Consortium

06/03/2025 | Indium Corporation
Indium Corporation®, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, thin-film, and thermal management markets, has joined Virginia Tech’s Center for Power Electronics Systems (CPES), an industry consortium that supports power electronics initiatives to reduce energy use while growing capability.
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