The Marketing Minute: If Your Marketing Budget Gets Cut in Half, Then What?
Punching Out: How Are the Big Boys in Electronics Doing?
It’s Only Common Sense: Complexity Is the Enemy of Profit
Pacific Scientific Energetic Materials Company Signs MOU with Space Information Laboratories to Provide Autonomous Flight Safety System
March 18, 2020 | Business WireEstimated reading time: 1 minute
Pacific Scientific Energetic Materials Company (California), LLC. (PacSci EMC) announced today the execution of a Memorandum of Understanding with Space Information Laboratories (SIL) to provide plug-and-play Autonomous Flight Termination Systems (AFTS) for launch vehicles, missiles, hypersonic vehicles, reentry vehicles, strike weapons and unmanned aerial systems. PacSci EMC Safe and Arm high voltage electronics will be integrated with the SIL Vehicle Based Independent Tracking System (VBITS) AFTU with internal GPS L1/L2 Receivers, IMU, together in a Consolidated Avionics® unit with reduced Space, Weight and Power (SWAP) requirements. Attributes include open, modular, stackable and reconfigurable (OMSR) avionics.
“SIL has very unique, leading-edge technology for the AFSS mission that when combined with the PacSci EMC flight qualified ordnance flight termination system provides a low cost, comprehensive solution for this critical need,” said Greg Scaven, President, PacSci EMC. “The AFSS architecture is RCC-319 compliant with the flexibility and safety necessary for platform success, and the system can be customized for unique applications.”
SIL is a leading provider of high-end Li-Ion Polymer Intelli-Pack® Avionics/Telemetry and FTS Batteries, VBITS GPS Tracking and Autonomous Flight Termination Systems (AFTS), Space Based Range, and Consolidated Avionics® flight units for DoD programs of national significance. Originally developed in 2006, VBITS has successfully flown many times without loss of GPS receiver lock and this heritage is being leveraged. SIL’s patented Vehicles Based Independent Range System (VBIRS) will track, destroy and send high data rate BLOS telemetry without the need for ground range instrumentation Radar, Flight Termination and/or Telemetry Systems, and thus greatly reduces launch, and weapon system test and evaluation, costs.
Edmund Burke, President of Space Information Laboratories, said: “I am very impressed with PacSci EMC’s broad product offering and technical capabilities. They rapidly filled a need for us that will result in accelerated growth.”
Share on:
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
Kymeta Joins Red Cat Initiative for Maritime Connectivity
05/15/2026 | Globe NewswireRed Cat Holdings, Inc. , a U.S.-based provider of advanced all-domain drone and robotic solutions for defense and national security, announced that Kymeta, a world-leading flat-panel satellite terminal manufacturer, has joined the Red Cat Futures Initiative, the company’s industry-wide consortium accelerating advanced autonomous systems for modern warfare.
SPARK Microsystems Selected for CAD $1M in Government of Canada-backed FABrIC Funding
05/14/2026 | BUSINESS WIRESPARK Microsystems, a Canadian fabless semiconductor company specializing in next-generation short-range wireless communications, has been selected by FABrIC as a CAD $1 million grant recipient funded by the Government of Canada.
System Architecture Beyond the Die With Advanced Packaging as the Scaling Factor
05/14/2026 | Chetan Arvind Patil, Marvell TechnologyIn conventional monolithic semiconductor design, system integration was achieved within a single die and constrained by reticle limits. Compute cores, cache, memory controllers, and input output (I/O) interfaces were all co-optimized on a single process node, with performance closely tied to transistor density and on-die interconnect efficiency. This monolithic system-on-chip (SoC) approach enabled low-latency communication and relatively straightforward power delivery. However, as design for compute-intensive SoCs approaches reticle limits and advanced-node costs increase, the ability to continue scaling within a single die begins to diminish.
Rethinking Reinforcement Materials for Advanced Packaging
05/14/2026 | Ivana Ivanovic, Flexiramics B.V.Materials that once quietly supported the industry are now becoming limiting factors. The electronics industry is experiencing unprecedented pressure as RF systems push into mmWave frequencies, high-speed digital architectures advance into their next performance generation, and power densities climb across automotive, telecom, aerospace, and computing. Reinforcement materials, long treated as a background detail in laminate design, are suddenly at the centre of performance, reliability, and supply‑chain discussions.
Below the Surface: Active Component and Module Submounts—The Architecture Behind Performance
05/14/2026 | Chandra Gupta -- Column: Below the SurfaceIf you were to peel back the layers of a modern electronic system, such as a satellite transceiver, a LiDAR module, or a 5G base station, you would not immediately notice a specific component doing some of the most important work. It doesn’t amplify signals, emit light, or process data, yet without it, none of those functions would be stable, reliable, or scalable. That component is the active device submount.