HK Wentworth Appoints New Asia CEO
July 18, 2019 | HK WentworthEstimated reading time: 1 minute
The directors and shareholders of HK Wentworth Group, the parent company of both Electrolube and AF International, has announced the appointment of Sharon Zhang to the board of directors of HKW Beijing. Zhang, previously the general manager of HKW Beijing, will uphold her new title as chief executive officer and vice president of the Asian operation, with immediate effect.
The appointment complements HK Wentworth’s strategic objectives to expand its investment in people at a time of considerable growth within the company. Zhang has been actively involved in developing the Chinese and Asian customer bases at HKW Beijing. As part of her new role as CEO and vice president, Zhang will be responsible for actively maintaining these customer relationships, driving sales to develop the customer base further and increasing the company’s market share in the sale of conformal coatings, thermal management solutions, encapsulation resins, contact lubricants, cleaning solutions and service and maintenance aids.
Ron Jakeman, HK Wentworth’s managing director, comments, “Sharon has been vital to the growth of the Asian operation over the last 17 years. She has been instrumental in developing the Beijing-based manufacturing facility from its inception in 2002 and has also steered the successful development of our new state-of-the-art R&D facility in Suzhou. More recently, Sharon has managed the relocation process to a new factory in Zhuji, which has been newly commissioned. As a people and customer centred individual with a strong history of creating highly engaged teams, Sharon has successfully secured high levels of domestic business and has the experience to take our Asian operation to the next level of growth and development. We wish Sharon every success in her new role as CEO and vice president of Asia.”
Commenting on her new appointment, Sharon Zhang said, “Since joining HKW Beijing in 2002, I’ve really enjoyed the challenge, especially the provision of innovative electronics protection solutions for the Asian market and close collaboration with customers. China has undergone substantial growth and we are proud to offer a reliable manufacturing resource for customers. I am delighted to join the board of directors at HKW Beijing and begin my new role as CEO and vice president of the Asian operation. I hope to make even more of an impact at a very vibrant time in the company’s growth.”
For further information visit www.hkw.co.uk.
Suggested Items
Meet Diana Radovan, IPC’s Global Sustainability Policy and Advocacy Lead
01/17/2025 | Marcy LaRont, I-Connect007Dr. Diana Radovan joined IPC in August 2024 as the advocacy lead for sustainability policy, a role that requires awareness of global policy activities. From the IPC Munich office, Diana has been busy working as a policy analyst with Dr. Kelly Scanlon, IPC lead sustainability strategist. In this interview, she shares her background, her role at IPC, and what she wants to accomplish for the benefit of our industry.
NAMICS Brings Innovative Thermoset Materials to PCB Fabrication
01/16/2025 | Andy Shaughnessy, Design007 MagazineAt PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.
Cicor Chosen as Key Manufacturing Partner For Advanced Military Aircraft Program
01/13/2025 | CicorCicor Group has been nominated by a leading European aerospace & defence (A&D) integrator as a key supplier to a new program of highly advanced electronic devices used in fast-jet aircraft.
TopLine to Sponsor IMAPS Wire Bonding Workshop in San Diego
01/09/2025 | TopLineTopLine Corporation will sponsor an Advanced Technical Workshop and Tabletop Exhibition on Wire Bonding February 3-4, 2025, in San Diego, California, hosted by The International Microelectronics Assembly and Packaging Society (IMAPS), it is announced today.
Martin Heinz Named New CEO of iTAC Software AG
01/08/2025 | iTAC Software AGMES/MOM provider iTAC Software AG has a new CEO: Martin Heinz will take over the position of Chief Executive Officer (CEO) with effect from January 1, 2025.