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Peters Leverages Inkjet Technology to Optimize PCB Manufacturing

01/17/2025 | Peters
Peters has put the second SUSS LP50 ‘Pixdro’ inkjet printer into operation. This machine enables the application of solder resist in digital additive technology by means of the inkjet process, thus providing Peters Research, in this relatively new segment, with more possibilities in research and process technology, in addition to the conventional coating processes (screen printing, curtain coating and spray coating).

TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)

01/16/2025 | TopLine Corporation
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Austin Expo & Tech Forum

01/16/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Austin Expo & Tech Forum taking place on February 6 at the Travis County Exposition Center in Austin, Texas.

Indium Expert to Present on Solder Solutions for AI and Automotive Applications at NEPCON Japan 2025

01/16/2025 | Indium Corporation
Indium Corporation Senior Area Technical Manager Jason Chou will deliver a technical presentation at NEPCON Japan, on January 22-24, in Tokyo, Japan.

ELMOTEC to Showcase SolderSmart® TOP Automated Soldering Equipment at APEX 2025

01/15/2025 | ELMOTEC
E-tronix, a Stromberg Company, is excited to announce that they will partner with ELMOTEC to showcase the SolderSmart® TOP Automated Soldering Equipment at APEX 2025 Booth #1703.
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