HON-Flex Chooses InCAM Flex as its Leading CAM Solution
March 9, 2017 | OrbotechEstimated reading time: 2 minutes
Orbotech Ltd. has announced that HON-Flex has chosen InCAM Flex as its preproduction CAM solution. Developed by Frontline PCB Solutions, InCAM Flex is a dedicated industry-leading, field-proven preproduction CAM solution, for flex and rigid-flex PCB makers that provides precise CAM tooling and production data optimization via flex design for manufacturing tools.
“Since migrating from GenFlex to InCAM Flex, we significantly improved our efficiency and production quality, expnding our competitive advantage,” said Mr. Brad Chang, Design Director at HON-Flex. “InCAM Flex’s large scale automation capabilities enables us to process more complex files, lower maintenance costs, and cut errors and CAM processing time. Scale and Stretch has increased our productivity by allowing us to scale connectors and stretch the connecting traces faster than before. We’ve also noticed quality improvements since using Advanced Etch Compensation, which performs smoother compensation while eliminating the need to manually repair compensated data.”
“We are delighted that HON-Flex has migrated to InCAM Flex,” said Walter Hsu, PSP Director in Orbotech Pacific. “InCAM Flex was designed to help PCB manufacturers meet the increasing challenges of a rapidly growing flex PCB market by optimizing their flex production processes. The substantial improvements that HON-Flex is already experiencing in their production process are testament to our abilities to provide the right solutions at the right time.”
About InCAM Flex
InCAM Flex provides fast, high-precision CAM tooling for flex and rigid-flex manufacturers and enables automatic production data optimization via flex design for manufacturing tools. Combined with powerful flex CAD tools and automatic flex board panelization, InCAM Flex brings with it benefits that are most important for businesses, increasing yields and achieving faster job turnaround. In addition, InCAM Flex seamlessly integrates and shares information with InPlan®Flex Engineering Suite, design and assembly via ODB++, and has a streamlined user interface.
About HON-Flex
Founded in 2003, Xiamen Hongxin Electron-tech Co., Ltd., specializes in the R&D, design, manufacture and sale of flexible printed circuit boards (FPC). Nurtured by the successful Hongxin Entrepreneur Incubator, HON-Flex focuses on producing high-precision FPCs for the mobile communications and consumer electronics industries. HON-Flex has strategic alliances with leading electronics companies both at home and abroad. In 2013, HON-Flex was ranked as the number one player in the China FPC industry. HON-Flex strives to be a world leader in the FPC industry and to realize its mission to: Establish a business to serve the country. Develop a business to strengthen the country.
About Orbotech
Orbotech Ltd. is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components.
Virtually every electronic device is produced using Orbotech technology. For more information visit www.orbotech.com.
Suggested Items
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
01/17/2025 | EINPresswire.comThe global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
DuPont Reaffirms Guidance, Accelerates Electronics Spin-off
01/16/2025 | PRNewswireDuPont announced the acceleration of the separation of its Electronics business and is now targeting November 1, 2025 to complete the transaction.
TRI to Join SMTA Austin Expo 2025
01/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Austin Expo 2025, scheduled to take place on February 6, 2025, at the Travis County Exposition Center.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.