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High-Tech Hill Technology Park Opens: Four New Factories Launched
September 26, 2025 | TeltonikaEstimated reading time: 1 minute
The ambitious vision announced in late 2020 to build a world-class technology park in Liepkalnis, Vilnius, has become a reality. AGP Investments, led by entrepreneur Arvydas Paukštys, together with high-tech leaders Teltonika and TLT, today inaugurated four new factories at the Vilnius High-Tech Hill Technology Park.
This milestone marks the completion of the first stage of the project and establishes one of the most advanced electronics production hubs in the region. The new facilities include:
- A printed circuit board (PCB) plant
- A plastics and mechanics plant
- An electronics assembly plant
- An electronic components plant
Together, these factories will enable the production of over 30 million electronic devices annually. Total investment in this first phase – including construction, land acquisition, and infrastructure development – exceeds €320 million.
FOUR NEW FACTORIES DRIVING GROWTH
High-Tech Hill is built on the principle of vertical integration, reducing reliance on supply chains in Asia and offering clients end-to-end electronics manufacturing services in one location – from PCB production to final product assembly. This development represents a breakthrough not only for Lithuania, but also for the broader European technology sector.
With today’s opening, the group’s production capacity expands from 10 million to 30 million electronic devices per year. By 2030, once the park is fully developed, capacity is expected to reach 100 million devices annually.
FACTS AND FIGURES ABOUT HIGH-TECH HILL TECHNOLOGY PARK
- Total area: 55 hectares
- Number of employees in the four new factories: 1,370
- Construction start: 2023
- Total investment: €320 million
- Sustainability: More than 6 MW of solar power plants installed on rooftops; total planned capacity of 17 MW. Total electricity consumption of the park: 74 MW
- Community infrastructure: Two new streets – Ditvos and Svylos – fully built, including 9,500 m² of paved roads with sidewalks, 3,200 m² of cycling paths, and a new roundabout for traffic safety
- Green areas: 468 trees and 3,847 shrubs planted, with 12,551 m² of landscaped green space
- Future development phases: R&D centre; semiconductor chip design, packaging, assembly, and testing plant; power module assembly plant; additional electronic component factories; AI data centre; and community infrastructure such as a shopping centre and parking facilities
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