Nolan’s Notes: Everyone Has Their Eye on India
Standard of Excellence: The Human Touch in an Automated World
The Government Circuit: Navigating New Trade Headwinds and New Partnerships
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
September 5, 2025 | SEMIEstimated reading time: Less than a minute
SEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year to US$33.07 billion in the second quarter of 2025. Second quarter 2025 billings registered a 3% quarter-over-quarter expansion supported by the leading-edge logic, advanced high bandwidth memory (HBM) related DRAM applications, as well as increase in shipments to Asia.
3a543fa278424bdc90f8ff27b22d4e40.png“The global semiconductor equipment market registered a strong first half of 2025 with more than $65 billion in revenue, building on the record billings of $117 billion in 2024,” said Ajit Manocha, SEMI President and CEO. “Chipmakers continue to invest in production capacity to support advanced logic and memory innovation powering the AI wave, as well as key projects to bolster regional supply chain resilience.”
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.
SEMICON Taiwan 2025 Hits Record Global Participation Amid AI-Driven Industry Shift
09/03/2025 | SEMISEMICON Taiwan 2025 enters its final countdown, spotlighting the global AI chip boom and the industry’s rapid transformation.