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The Hidden Geography of Electronics: Rethinking Trade, Inputs, and Strategic Advantage
August 27, 2025 | Dr. Shawn DuBravac, Global Electronics AssociationEstimated reading time: 1 minute
Beneath the surface of debates about reshoring, tariffs, and supply chain resilience lies a deeper reality: Global electronics manufacturing is increasingly driven by the flow of inputs, not just the shipment of final goods.
Electronics manufacturing is not just global; it is globally interdependent. In 2023 (the most recent data available), electronics trade reached $4.4 trillion, accounting for more than 20% of total global merchandise trade. This figure reflects not only strong consumer demand for smartphones, computers, and electric vehicles, but also the dense web of international transactions behind each finished product.
Electronic components such as semiconductors, circuit boards, connectors, sensors, and batteries now account for most trade in the electronics sector. This dynamic has accelerated in recent years, reflecting the growing complexity of both devices and supply chains.
In 2023, global trade in electronics inputs exceeded trade in finished electronics by more than $400 billion. As products become more technologically advanced, they require a larger number of specialized parts, many produced in only a handful of locations. The result is a supply chain that is highly fragmented, deeply layered, and tightly interconnected across borders.
This interdependence is structural. No country controls the entire value chain, and efforts to achieve “technological self-sufficiency” must reckon with the deep-rooted realities of global specialization. For companies and policymakers, understanding this hidden geography is essential. Resilience may depend less on isolation and more on how interdependence is managed.
Continue reading this article in the Summer 2025 issue of Community Magazine.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.
Aircraft Wire and Cable Market to surpass USD 3.2 Billion by 2034
10/30/2025 | Global Market Insights Inc.The global aircraft wire and cable market was valued at USD 1.8 billion in 2024 and is estimated to grow at a CAGR of 5.9% to reach USD 3.2 billion by 2034, according to recent report by Global Market Insights Inc.
Building PCBs and Policy in Europe: Group ACB Champions Advocacy, Standards Development, and Technical Leadership
10/30/2025 | Linda Stepanich, Community MagazineHow does a European PCB manufacturer navigate the competitive manufacturing landscape in Europe? By participating in standards development committee meetings, testifying before the European Commission on industry issues, and sponsoring hand-soldering competitions in the region. Group ACB, based in France and Belgium, focuses on high-reliability applications. The 37-year-old company is also active in the Global Electronics Association, giving credit for helping ACB to raise awareness of electronics manufacturing in Europe.
GlobalFoundries Announces Chief Financial Officer Transition
10/28/2025 | GlobalFoundriesGlobalFoundries (GF) announced that, effectively immediately, John Hollister, GF’s Chief Financial Officer, is leaving the company for personal reasons. Sam Franklin, GF’s Senior Vice President of Business Finance, Operations and Investor Relations, will assume the position of Interim Chief Financial Officer while the company conducts a search for a permanent CFO.