-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Review: PCEA Orange County Summer Meeting
August 6, 2025 | Dan Feinberg, Technology Editor, I-Connect007Estimated reading time: 2 minutes

The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership.
PCEA regularly hosts events for management, process engineers, and suppliers from various corners of the industry to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.
We started with lunch, which is a great opportunity to say hello, and discuss industry status, new processes and products. During lunch, the new leadership team was introduced. They explained their goal to provide resources, networking opportunities, and professional development for the members. They want to embrace innovation, not only in design and manufacturing, but also in standards development, sustainability, and talent cultivation within the industry.
After lunch, our first speaker was Stephen Chavez, whose presentation focused on best practices in PCB design, including optimizing engineering to maximize manufacturing efficiencies. He emphasized the need for more process engineers and discussed engineering goals such as minimizing the risk and maximizing the reliability when designing. He further explained the high value of design up front rather than having to fix poor design efficiencies found after the device is manufactured.
Chavez spoke about the accelerating demand for high density interconnect (HDI) boards, driven by the proliferation of compact devices like smartphones, wearables, and IoT solutions. He said miniaturization is affecting design complexity, requiring advanced simulation tools and tighter tolerances in both fabrication and assembly. The rise of flexible and rigid-flex circuits means new opportunities in medical devices, automotive electronics, and aerospace applications.
Other speakers during the event addressed the environmental impact of PCB production, from raw material sourcing to end-of-life disposal and especially of design for manufacturing (DFM). They explored new eco-friendly materials, recycling initiatives, and the adoption of closed-loop manufacturing systems that minimize waste. They also spoke about the critical role of education in maintaining industry excellence.
We learned about certification programs, such as IPC Designer Certification, and initiatives to attract new talent to the field, including university partnerships, mentorship opportunities, and outreach to underrepresented groups. We were encouraged to share our knowledge and experiences, nurturing the next generation of PCB engineers.
Finally, a panel discussion debated the roadmap for the industry’s future:
- The growing intersection of electronics and software, particularly as embedded systems become more complex and interconnected.
- Cybersecurity concerns in connected devices, and the need for secure-by-design practices at both hardware and firmware levels.
- Supply chain resilience, including strategies for multi-sourcing and onshoring critical components.
- The potential of quantum computing and photonic circuits, and what these technological leaps might mean for traditional PCB design paradigms.
- Globalization versus localization: how shifting economic and political landscapes may alter where and how PCBs are designed and manufactured.
The Orange County event offered a good view of the state of printed circuit engineering today, blending technical rigor with a forward-looking perspective. You learn about new design and manufacturing, meet industry leaders and associates, and discover opportunities that will accelerate your place and growth in the industry and advance your career more rapidly.
See you at the next one?
Dan Feinberg is a technical editor at I-Connect007 and founder of Fein-Lines Associates.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Cadence Giving Foundation Announces Multi-Year Commitment to Expand the AI Hub at San José State University
10/13/2025 | Cadence Design Systems, Inc.The Cadence Giving Foundation today announced a multi-year commitment to expand the AI Hub at San José State University (SJSU) to equip students with the skills, hands-on training and experience needed to excel in careers in artificial intelligence (AI).
NEDME Returns October 22 — The Northwest’s Premier Design & Manufacturing Expo
10/13/2025 | NEDMEThe Northwest Electronics Design & Manufacturing Expo (NEDME) returns on Wednesday, October 22, 2025, at Wingspan Event & Conference Center, Hillsboro. The event brings together engineers, product designers, manufacturers, educators, and community partners for a full day of industry connection, learning, and networking.
Sumitomo Riko Boosts Automotive Design Efficiency 10x with Ansys AI Simulation Technology
10/13/2025 | SynopsysSumitomo Riko is implementing Ansys, part of Synopsys, Inc. AI technology to accelerate time-to-solution and improve efficiency during the design and manufacturing of automotive components.
Si2 Names NVIDIA, Synopsys Technologists to Lead New LLM Benchmarking Coalition
10/10/2025 | BUSINESS WIREThe Silicon Integration Initiative today announced the chair and vice chair of the Si2 Large Language Model Benchmarking Coalition (LBC), a collaborative industry initiative and standards body advancing AI for silicon design and verification that will expedite the development of high-quality large language models for semiconductor design problems.
Quilter Secures $25M Series B to Eliminate Manual PCB Design with Physics-Driven AI
10/09/2025 | BUSINESS WIREQuilter, the first and only company to publicly demonstrate fully autonomous PCB layout through physics-driven AI, announced $25 million in Series B funding led by Index Ventures.