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Technica USA Welcomes Bill Dodd of Essemtec to the Bay Area
July 28, 2025 | Technica USAEstimated reading time: 1 minute
Technica USA was pleased to welcome the good news regarding Essemtec’s decision to relocate Bill Dodd, Applications Engineer, from Boston to the Bay Area.
Bill brings with him a wealth of experience in Essemtec’s advanced equipment and technology. His seven years of expertise in the PCBA market will provide further support to our customers in identifying effective application solutions and addressing challenges in their manufacturing processes.
Essemtec, a leading manufacturer of dispensing, jetting, and placement equipment, offers a range of innovative products, including the PUMA 2 —an all-in-one solution ideal for New Product Introduction (NPI) applications and small production runs. This system allows manufacturers to test and validate new designs without disrupting ongoing production lines.
During a recent visit to San Jose for mid-year meetings, the PCBA Sales Team at Technica had the opportunity to meet and welcome Bill to the region and discuss collaborative initiatives aimed at enhancing customer support and engagement.
Jason Perry, President of Technica USA, stated: “We are excited to have Bill based in the Bay Area to work alongside our team to provide application support and demonstrations for our customers. With the
PUMA 2 and TARANTULA systems now installed in our San Jose Demo Center, and Bill’s technical knowledge on hand, we anticipate an increase of interest in conducting demonstrations of Essemtec’s many solutions.”
Bill will be working out of the Technica San Jose facility until the completion of the new Nano-Dimension San Jose office and applications lab.
Contact Yannick Green, ygreen@technica.com, of Technica or Frank Santos, Frank.Santos@nano-di.com, to arrange your private demonstration.
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Rachael Temple - AlltematedSuggested Items
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SMTA 'Members of Distinction' Awards Announced
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PEDC Call for Abstracts Deadline Extended to Aug. 31
08/20/2025 | I-Connect007 Editorial TeamThe second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The Knowledge Base: Cultivating Your Brand in the Age of Connection
08/19/2025 | Mike Konrad -- Column: The Knowledge BaseAudiences have evolved in how they consume information, form opinions, and make purchasing decisions. While marketing still relies on tried-and-true methods—get your name and message in front of your audience—you must also cultivate connection, credibility, and community. Your customers, particularly the younger generation of engineers, buyers, and program managers, want to discover value on their terms.
Technica Demo Days Event Proves to Be Beneficial to Customers
08/18/2025 | Technica USATechnica USA’s Demo Days Event, took place August 13–14 at the company’s Demo Center in San Jose, California. The event featured live demonstrations and presentations from key supply partners ESSEMTEC, INOVAXE, and PARMI showcasing the latest innovations in SMT manufacturing and automation technology.