-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
SEMI, TechSearch International Release 2025 Edition of Worldwide Semiconductor Assembly & Test Facility Database
July 1, 2025 | SEMIEstimated reading time: 1 minute
SEMI and TechSearch International announced the release of the 2025 edition of the Worldwide Semiconductor Assembly & Test Facility Database, the industry’s most comprehensive resource tracking global assembly and test sites operated by integrated device manufacturers (IDMs) and outsourced semiconductor assembly and test providers (OSATs).
The Worldwide Assembly & Test Facility Database remains an indispensable tool for mapping the global semiconductor supply chain, identifying new capacity, and tracking technology adoption across regions. The 2025 report’s expanded content and improved structure further strengthen its value for industry stakeholders seeking actionable intelligence in a rapidly evolving market.
“The 2025 edition of the Worldwide Assembly & Test Facility Database reflects the dynamic growth and increasing complexity of the global semiconductor supply chain,” said Clark Tseng, Senior Director of Market Intelligence at SEMI. “By expanding our coverage and incorporating new data features, we are providing industry stakeholders with a deeper understanding of global packaging and testing capabilities, technology adoption, and regional trends as the market continues to evolve.”
The 2025 edition delivers several significant updates and enhancements:
- Expanded Coverage: The database now includes 750 facilities worldwide, an increase of 70 new sites compared to the 2024 edition, reflecting ongoing industry investment and expansion.
- Enhanced Data Structure: New columns have been added to improve data granularity and usability:
- Each facility is now assigned a unique Facility ID for easier reference and tracking.
- Additional columns detail device types, including memories, logic/analog ICs, power devices, RF/MEMS chips, and CMOS image sensors, enabling users to identify specialized manufacturing and test capabilities at a glance.
- The startup year for some facilities is now included, providing insights into the operational history and maturity of each site.
- Regular Facility Updates: In addition to these new features, the database continues to offer up-to-date information on facility status, ownership, location, plant type, production capabilities, and certification status, supporting strategic decision-making for manufacturers, suppliers, and analysts.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Brian O’Donnelly Appointed to Expanded Role, Strengthening Global Leadership to Drive Growth in the Fujifilm’s Electronic Materials Business
07/31/2025 | FujifilmFUJIFILM Corporation (President and CEO, Representative Director: Teiichi Goto) today announced that the company has appointed Brian O’Donnelly as its Corporate Vice President, strengthening global leadership to drive growth in the Electronic Materials Business.
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
ASMPT Earns Global Recognition for Outstanding Customer Service in 2025 TechInsights Survey
07/31/2025 |ASMPT has been recognised for excellence in the 2025 TechInsights Global Semiconductor Supplier Survey for the 12th consecutive year. This year, it was ranked third for excellence in customer service among large equipment suppliers.
Semiconductors Get Magnetic Boost with New Method from UCLA Researchers
07/31/2025 | UCLA NewsroomA new method for combining magnetic elements with semiconductors — which are vital materials for computers and other electronic devices — was unveiled by a research team led by the California NanoSystems Institute at UCLA.
SEMI Reports Worldwide Silicon Wafer Shipments Increase 10% Year-on-Year in Q2 2025
07/29/2025 | SEMIThe SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 9.6% year-on-year to 3,327 million square inches (MSI) from the 3,035 MSI recorded during the same quarter of 2024.