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Marcy's Musings: The Hole Truth—Via Integrity in an HDI World

This month, we’re talking about “the hole truth,” namely, via reliability in an HDI world. As I contemplated what it takes to get the “perfect” via, it got me thinking about what it takes to create the “perfect” magazine issue.

Just as via reliability requires a series of essential steps, so does the process of putting a magazine together. From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, fabricators aim for quality and reliability—the first time, and every time.

It’s the same with our magazines. From the initial brainstorming to reaching out to contributors to writing, editing, and layout, we aim for a perfect issue every time. We also aim for a cover image that, while it might sometimes seem playful or even bizarre, accurately portrays the whole story.

I’d like to give some well-deserved kudos to Shelly Stein, our art director. Her talent and creativity can be seen in the carefully selected images throughout each issue. This is nowhere no more apparent than on our covers. She helps us visualize often intangible concepts, giving life, interest, and appeal to the important topics we’re writing about. (Round of virtual applause, please.)

While Shelly is an integral component of the entire process, every step is vital. There isn’t one more important than another. Such is the case with via reliability. What do you consider in your processes? Is it time to rethink the cross-section as a primary test and measurement mechanism? Can advanced inline AOI technology increase quality and reliability in real-time? Can you really drill a perfect hole?

We start our discussion on superior hole quality in an interview with Stefan Rung of Schmoll Maschinen. This is followed by an interview with Giovanni Obino of MKS’ Atotech about inline AOI technology. Bob Neves adeptly addresses, “The Death of the Microsection.” These articles are followed by feature columns from Don Ball and Michael Carano, and Happy Holden draws on previous content from his friend and mentor, Dr. Karl Dietz, to talk about plated through-hole reliability and voids.

Outside of our chosen topic, I’ve selected a white paper excerpt on digital twin and copper plating from the PEDC conference in Vienna this past January. I’m also including Anaya Vardya’s latest article (first published in the May 2025 issue of Design007 Magazine) in his series called “UHDI Fundamentals,” where he delves into ways UHDI technology is being used in smart home products. It’s definitely interesting! Becky Calwell and Myrium Sullivan of Jobs for the Future confront the challenges of an aging workforce, and Manfred Huschka offers up a China Plus One success story in Vietnam.

Finally, Dan Feinberg continues his profiles of IPC Hall of Fame recipients by highlighting the life and career of Lionel Fullwood.

It’s a full issue, so dive in and let’s get started.

This column originally appeared in the June 2025 issue of PCB007 Magazine.