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Roll-to-Roll Technologies for Flexible Devices Set to Grow at 11.5% CAGR
June 11, 2025 | GlobeNewswireEstimated reading time: 1 minute
According to the latest study from BCC Research, the “Global Markets for Roll-to-Roll Technologies for Flexible Devices” is expected to reach $69.8 billion by the end of 2029 at a compound annual growth rate (CAGR) of 11.5% from 2024 to 2029.
The report offers an in-depth analysis of roll-to-roll (R2R) technologies for flexible devices, covering various device types and fabrication processes. It identifies current and emerging devices and provides detailed market segmentation by process category, substrate material, deposition method, end-use industry and region. The report includes a technological review of the fabrication steps and highlights the most active research organizations in this field and their activities.
The rapid advancements in flexible electronics provide valuable insights into the market size, growth trends, players and emerging applications of R2R technologies. The report highlights the increasing demand for flexible and wearable devices, driving the adoption of R2R technologies for cost-effective, high-volume production. Additionally, the rising demand for R2R-produced solar cells and flexible devices in consumer electronics, optoelectronics and the automotive industry makes this report particularly timely and vital.
The factors driving the market include:
Demand for Flexible Devices: Flexible devices are increasingly popular in consumer electronics (like foldable phones), optoelectronics (such as OLED displays), and the automotive industry (for smart sensors and displays). They offer portability, durability, and innovative designs.
Rising Demand for R2R-Produced Solar Cells: Roll-to-Roll technology enables cost-effective, flexible solar panels. These are crucial for renewable energy solutions, making solar power more accessible and versatile.
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Flexible Circuit Technologies to Host Free Flex Heater Webinar
08/18/2025 | Flexible Circuit TechnologiesGlobal Supplier of flexible circuits, flex design services, and assembly/box-build services, Flexible Circuit Technology will host their latest webinar, "Thermal Precision Meets Flexibility: The Technology Behind Heater Circuits" on Tuesday, August 26th, 2025 at 11 AM EDT.
Trouble in Your Tank: Metallizing Flexible Circuit Materials—Mitigating Deposit Stress
08/04/2025 | Michael Carano -- Column: Trouble in Your TankMetallizing materials, such as polyimide used for flexible circuitry and high-reliability multilayer printed wiring boards, provide a significant challenge for process engineers. Conventional electroless copper systems often require pre-treatments with hazardous chemicals or have a small process window to achieve uniform coverage without blistering. It all boils down to enhancing the adhesion of the thin film of electroless copper to these smooth surfaces.
OKI Launches Rigid-Flex PCBs with Embedded Copper Coins Featuring Improved Heat Dissipation for Space Equipment Applications
07/29/2025 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has developed rigid-flex PCBs with embedded copper coins that offer improved heat dissipation for use in rockets and satellite-mounted equipment operating in vacuum environments.
North American PCB Industry Sales Down 8.6% in June 2025
07/28/2025 | Global Electronics AssociationThe Global Electronics Association announced the June 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.06.