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When Small Just Isn’t Small Enough; INSPECTIS Launches Micro Size Optical Probe Tip for BGA Inspection

06/03/2025 | INSPECTIS
The Inspectis BGA inspection system now offers the tiniest optical probe, the Micro Size Optical Probe Tip, for users who feel that they need to get ‘really small’.

DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot

06/03/2025 | TrendForce
TrendForce’s latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes.

Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.

Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains

05/29/2025 | Siemens
Siemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.

JBD Sets a New Benchmark for MicroLED Micro-Display Technology

05/29/2025 | PRNewswire
At this pivotal juncture when near-eye display technologies are rapidly advancing toward large-scale deployment, JBD, through sustained technological innovation, has succeeded in reducing the number of defective pixels in its MicroLED micro-displays from ≤100 to ≤3 per panel.
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