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IPC Applauds Leadership of Reps. Moore and Krishnamoorthi on PCB Manufacturing Bill
May 28, 2025 | IPCEstimated reading time: Less than a minute
IPC, the global electronics association serving more than 1,400 U.S. companies and over 3,200 worldwide, strongly supports the bipartisan reintroduction on May 28 of the Protecting Circuit Boards and Substrates (PCBS) Act in the 119th Congress. Championed by Rep. Blake Moore (R-UT) and a new lead co-sponsor Rep. Raja Krishnamoorthi (D-IL), the bill targets a critical vulnerability in the U.S. electronics supply chain by:
- Authorizing $3 billion in federal investments for domestic PCB and IC substrate production and,
- Establishing a 25% tax credit for companies that source U.S.-made PCBs and substrates
“The PCBS Act addresses a critical and long-overlooked weakness in America’s electronics supply chain,” said John W. Mitchell, IPC President and CEO. “Every electronic device relies on PCBs and substrates, but the U.S. no longer has the capabilities or capacity to meet current demand, much less address future technology requirements. This bill is a vital step toward rebuilding the nation’s ability to manufacture electronics from silicon to systems—an essential foundation for innovation, security, and economic strength.”
Read more about the bill's reintroduction here.
Suggested Items
Yannick Green Joins Technica USA as Business Development/Account Manager for Northern California and Northern Nevada
07/07/2025 | Technica USATechnica USA is proud to announce that industry veteran Yannick Green has rejoined Team Technica as Business Development/Account Manager, supporting both supply partners and PCBA customers across Northern California and Northern Nevada.
China Plus One, Part 3: Inorsen Group, a Vietnam Success Story
07/03/2025 | Manfred Huschka, Manfred Huschka Management Consulting (Shenzhen) Ltd.In recent years, Western OEMs have continued to push for China Plus One factories and the advancement of China’s Belt and Road Initiative (BRI). At present, there are two main modes for PCB companies to go global: building greenfield factories or through mergers and acquisitions (M&A). Thailand is currently the primary geographic choice to build greenfield factories, whereas, increasingly, mergers and acquisitions in Vietnam and Malaysia provide opportunities for companies to expand markets and acquire resources.
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
06/19/2025 | Jerome Larez -- Column: Global PCB ConnectionsA promising advancement in this space is the integration of embedded components directly within the PCB substrate. Embedded components—such as resistors, capacitors, and even semiconductors—can be placed within the internal layers of the PCB rather than mounted on the surface. This enables designers to maximize available real estate and improve performance, reliability, and manufacturability.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.