Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
Standard of Excellence: Overcoming Service Failures—The Art of the Apology
ClassOne Technology, IBM Research Jointly Developing Non-NMP Solvent Processing for Semiconductor Manufacturing
May 26, 2025 | ClassOne TechnologyEstimated reading time: Less than a minute
ClassOne Technology, a leading global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, announced it has signed a joint development agreement with IBM Research focused on wet processing for advanced packaging. The two companies will leverage their respective semiconductor chemistry expertise to create innovative solvent solutions for a range of advanced semiconductor and packaging process applications.
The focus of the joint project will be to develop best known methods (BKMs) for non-NMP solvent processing in manufacturing IBM semiconductor devices. NMP, or N-Methylpyrrolidone, is a chemical compound long used in a variety of industries, including semiconductor fabrication, for removal of surface materials.
ClassOne has been a strategic supplier to IBM since 2014, developing technologies in electroplating, metal lift-off (MLO) and wet cleaning processes, and subsequently expanding to advanced packaging applications.
ClassOne CEO Byron Exarcos noted, “This collaboration represents a significant step forward in developing alternatives for advanced semiconductor processing. Combining our flexible wafer-processing platform and seasoned team with IBM’s extensive research experience and resources will result in novel solutions that we look forward to sharing throughout our industry.”
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Dutch Government Takes Control of China-Owned Chipmaker Nexperia, Citing Security Concerns
10/14/2025 | I-Connect007 Editorial TeamThe Dutch government has taken control of Chinese-owned chipmaker Nexperia, escalating tensions with Beijing amid intensifying global disputes over semiconductor technology and intellectual property.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
SEMICON West: The Path to a $1 Trillion Future
10/14/2025 | Marcy LaRont, I-Connect007After more than 50 years in San Francisco, SEMICON West moved its 2025 show to Phoenix, which is significant because it highlights the importance of Arizona as a semiconductor and tech hub. Though the show will be back in San Francisco in 2026, the overwhelmingly warm welcome SEMI received from Arizona Governor Katie Hobbs, Phoenix Mayor Kate Gallego, and ASU President Michael Crowe—who has been responsible for ASU repeatedly achieving the U.S. News and World Reports most innovative university ranking—was remarked upon repeatedly. All indications are that SEMICON West may well be back in Phoenix after that 2026 season.
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Thallner Recognized for Leadership and Innovation in Semiconductor Equipment and MEMS Manufacturing
10/10/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced Erich Thallner, President and Co-founder of EV Group (EVG), as its first SEMI Americas Catalyst Award recipient at SEMICON West 2025.