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Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
Advancements in High-reliability Alloys for Automotive and High-performance Applications
May 22, 2025 | Barry Matties, I-Connect007Estimated reading time: 1 minute
At IPC APEX EXPO, MacDermid Alpha Electronic Solutions showcased its latest innovations in SMT assembly materials designed to meet the growing demands for reliability and sustainability in automotive and high-performance applications. In this interview, Ebad Rehman, business product manager, discusses the evolution of high-reliability alloys, spotlighting ALPHA® Innolot®, a proven solution developed in response to the automotive industry’s increasing expectations for durability and performance under harsh operating conditions.
He also introduces a new reworkable edgebond that supports sustainability goals by enabling component reworkability, improving manufacturing yields, and minimizing scrap, making it ideal for critical automotive applications requiring exceptional board-level reliability. Additionally, Beth Turner, senior technical manager for Electrolube, shares insights into the development of conformal coatings and thermal interface materials, emphasizing their role in enhancing PCB reliability and performance in harsh environments.
Barry Matties: Ebad, it is good to speak with you. Why don’t we start with a general overview of your product lines?
Ebad Rehman: My product line is primarily focused on high-reliability solutions and materials for SMT applications, including edgebond, underfills, Innolot, and the future generation of high-reliability alloys. These products are focused on ultra-high-density interconnects (UHDI) and next-generation electronics assemblies in automotive, aerospace, and high-performance computing markets. Recently, we introduced our newest HiTech®, which contributes to sustainability and provides flexibility.
Matties: What problem are you trying to solve when looking at the reliability products?
Rehman: When we look at reliability, it's a continuum. In the early 2000s, the first lead-free high-reliability alloy was introduced. MacDermid Alpha was part of the consortium that led to the advent of Innolot, which is now synonymous with higher reliability alloys. That continuum means we’re always evolving our solutions—what worked five years ago simply won’t meet the demands of today’s electronics.
As we look at trends, we are especially driven by the automotive market segment, where in-use longevity and time-to-failure are critical. These are mission-critical applications fuel that reliability continuum: each new generation of electronics tests the limits of existing materials, so we must continuously push performance higher.
To read this entire In-depth with... MacDermid Alpha Electronics Solutions interview which appears in the May 2025 issue of Design007 Magazine, click here.
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