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NY CREATES, Fraunhofer Institutes Announce Joint Development Agreement to Advance Memory Devices at the 300mm Wafer Scale

05/16/2025 | NY CREATES
NY CREATES and Fraunhofer IPMS announced at a signing ceremony a new Joint Development Agreement (JDA) to drive research and development focused on memory devices.

DuPont to Introduce Advanced Kalrez Sealing Innovations for Semiconductor Manufacturing at SEMICON Southeast Asia

05/15/2025 | DuPont
DuPont is excited to announce its participation in SEMICON Southeast Asia (SEMICON SEA), taking place May 20-22, 2025, in Singapore. At booth L3105,

KEC International Lands New Orders, Including Semiconductor Breakthrough

05/14/2025 | KEC International
KEC International Ltd., a global infrastructure EPC major and RPG Group company, has announced securing new orders totaling ₹1,034 crores across its diverse business segments.

Legislative Update: Is the SEMI Investment Act Inclusive of PCB and Substrates?

05/13/2025 | I-Connect007 Editorial Team
In response to this week's news about new U.S. legislation being put forth by SEMI to support our domestic electronics supply chain—the Strengthening Essential Manufacturing and Industrial (SEMI) Investment Act—IPC’s Richard Capetto, senior director of North American Government Relations, made the following statement.

DuPont to Showcase Advanced Semiconductor Wet Etching Innovations at the Surface Preparation and Cleaning Conference

05/13/2025 | DuPont
DuPont announced that it will present its latest developments in semiconductor wet etching technologies at the upcoming Surface Preparation and Cleaning Conference (SPCC) in Chandler, Arizona, beginning May 20.
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