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New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
May 14, 2025 | I-Connect007Estimated reading time: Less than a minute

I-Connect007 is excited to share the latest episode of our new podcast series, which delivers expert technical insights for the printed circuit board and electronics manufacturing industry.
In this episode of On the Line with... NCAB: PCB Thermal Management, we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
As the industry’s longest-running digital media company, I-Connect007 delivers the original content you need—magazines, books, in-depth features, newsletters, podcasts, webinars, and event coverage—to keep you informed and ahead of the curve.
Don’t miss Episode 3 of this insightful series—and be sure to download the free companion guide!
Learn about this and many other topics by visiting I-007e Educational Resource Center.
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Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
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The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
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Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
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