Global Sourcing Spotlight: Tariffs—The New Reality
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
Punching Out: Your Financial Preparation for a Sale
New Guide Offers In-Depth Look at Thermal Management in PCB Design
April 14, 2025 | I-Connect007Estimated reading time: Less than a minute
I-Connect007 is proud to release The Companion Guide to PCB Thermal Management, a must-have resource designed to complement NCAB’s popular podcast series. Created for engineers and PCB designers, this guide offers a comprehensive look at critical thermal management strategies essential for today's high-performance electronics.
As devices become more powerful and compact, effective heat management is no longer optional—it’s vital to maintaining long-term reliability and performance. This resource identifies primary heat sources on a PCB—such as active components, high-power currents, high-frequency signals, and external environmental conditions—and explains the potential risks of insufficient thermal control, including component degradation and system failure.
To address these challenges, this guide presents a range of proven heat dissipation techniques, including:
- Optimized layout and component placement
- Advanced thermal simulation tools
- Strategic material selection
- Copper thickness adjustments
- Use of thermal vias and insulated metal substrates (IMS)
- Implementation of cutting-edge copper coin technology
This companion guide empowers engineers to prevent costly redesigns and optimize PCB functionality by stressing the importance of integrating thermal considerations from the outset. It is an essential read for those designing durable, high-performance electronics.
Now available for download here.
Share on:
Suggested Items
New Episode of NCAB Podcast Series Explores Cutting-edge Thermal Management Solutions
05/14/2025 | I-Connect007In this episode we continue the conversation with NCAB Field Application Engineer Ryan Miller as we dive into practical design and manufacturing techniques for controlling thermal effects. Topics include via farms, insulated metal substrates, coin technology, and copper pedestals—solutions that help meet today's high-performance demands.
Laird Thermal Systems Unveils New Identity
05/05/2025 | Laird Thermal SystemsLaird Thermal Systems, a global leader in active thermal management solutions with more than 60 years of application expertise, today announced its rebrand to Tark Thermal Solutions.
Ansys Strengthens Collaboration with TSMC on Advanced Node Processes Certification and 3D-IC Multiphysics Design Solutions
04/24/2025 | PRNewswireThrough continued collaboration with TSMC, Ansys announced enhanced AI-assisted workflows for radio frequency (RF) design migration and photonic integrated circuits (PICs), and new certifications for its semiconductor solutions. Together,
Explore Thermal Management Solutions in Latest Podcast Series—New Episode Now Available
04/30/2025 | I-Connect007I-Connect007 is excited to share the latest episode in our new podcast series! In this episode, Ryan returns to discuss practical strategies for managing heat, starting early in the design planning and specification phases. After all, prevention means there’s less to mitigate later.
Google Signs Taiwan’s First Corporate Geothermal Energy Deal in Asia-Pacific
04/23/2025 | I-Connect007 Editorial TeamGoogle announced that it has entered Taiwan’s first corporate geothermal power purchase agreement (PPA) with Baseload Capital to expand access to around-the-clock clean energy in the Asia-Pacific region and beyond.