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How to Discover and Equip the Next Generation of Talent
February 18, 2025 | Stephen V. Chavez, Siemens EDAEstimated reading time: 1 minute

The demand for skilled PCB designers is at an all-time high, with one-third of engineering jobs in the United States going unfilled. Addressing this talent gap involves solving two interconnected challenges: discovering where to find the next generation of PCB designers and equipping them with the necessary skills to thrive in a rapidly evolving field. These two efforts are fundamentally linked and require a strategic approach that bridges education, mentorship, and innovation.
Where Will We Find the PCB Designers of the Future?
· High school outreach and engagement: One promising avenue is early exposure. High schools can be fertile ground for identifying and cultivating young talent, especially if we make PCB design accessible and relatable. Framing design as a creative, problem-solving discipline that is not unlike the strategies and skills used in video games can capture students’ imaginations. Interactive workshops, hackathons, and design competitions tailored to younger generations could demystify the field and demonstrate its relevance to everyday life and its potential as a very fruitful career choice. A good example of fostering the new generations is the national program such as FIRST (For Inspiration and Recognition of Science and Technology), a global nonprofit 501(c)3 organization that prepares young people for the future through a suite of inclusive, team-based robotics programs for ages 4-18 (grades preK-12).
· Apprenticeships and internships: Apprenticeships provide a hands-on approach to learning that complements theoretical education. By partnering with local businesses, trade schools, and colleges, companies can offer real-world experience to young people. This model not only fills immediate staffing needs but also nurtures long-term talent pipelines.
To continue reading this article, which originally appeared in the February 2025 Design007 Magazine, click here.
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New RF Materials Offer Options for RF Designers
04/29/2025 | Andy Shaughnessy, Design007 MagazineThe RF materials arena has changed quite a bit in the past decade. The newest thermoset laminates boast performance numbers that are almost competitive with PTFE, but without the manufacturability challenges. At IPC APEX EXPO this year, I spoke with Brent Mayfield, business development manager at AGC Multi Material America. Brent walked through some recent innovations in RF materials, advances in resin systems, and the many design trade-offs for RF engineers to consider for each material set.