-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Biden-Harris Administration Announces CHIPS Incentives Award with HP to Support Domestic Manufacturing of Next-Gen Technologies and ‘Lab-to-Fab’ Ecosystem
January 13, 2025 | U.S. Department of CommerceEstimated reading time: 2 minutes
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded HPI Federal LLC up to $53 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. This award will support the expansion and modernization of the existing facility of HP Inc. (“HP”) in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (R&D) activities to commercial manufacturing operations, and serves as one of three R&D Centers for Excellence within the company’s global footprint. The award comes after the previously signed preliminary memorandum of terms, announced on August 27, 2024, and the completion of the Department’s due diligence. The Department will disburse the funds based on HP’s completion of project milestones.
“Companies like HP are developing the technologies that will spur unprecedented breakthroughs for generations to come,” said U.S. Secretary of Commerce Gina Raimondo. “By investing in companies and R&D projects across the semiconductor ecosystem, the Biden-Harris administration is helping to build and secure the domestic semiconductor capabilities that will help the United States continue to out-compete and out-build the rest of the world.”
Among other products, the CHIPS funding would support the manufacturing of silicon devices that are key components of life sciences lab equipment, which are used in drug discovery, single-cell research, and cell line development. By leveraging HP’s expertise in microfluidics and microelectromechanical systems (MEMS), these devices allow for increased speed and precision during life sciences R&D. The project is estimated to create and sustain nearly 150 construction jobs and over 100 manufacturing jobs.
“From semiconductors to supercomputers, President Biden’s Investing in America agenda is ensuring that America continues to be a global leader for invention and entrepreneurship,” said White House Deputy Chief of Staff Natalie Quillian. “Today's announcement with HP will build on the company’s 86-year history driving American innovation and support U.S. competitiveness in the 21st century.”
“HP is pleased its CHIPS grant has been finalized, which will bolster semiconductor production and innovation in the United States. This significant development will accelerate our work and innovation in Micro-Electro-Mechanical Systems (MEMS) technology, which directly benefits the U.S. semiconductor and life sciences industries, as well as strengthens global competitiveness,” said Enrique Lores, President and CEO, HP.
As stated in the CHIPS Notice of Funding Opportunity for Commercial Fabrication Facilities, CHIPS for America will distribute direct funding to recipients for capital expenditures based on the completion of construction, production, and commercial milestones. The program will track the performance of each CHIPS Incentives Award via financial and programmatic reports, in accordance with the award terms and conditions.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
01/16/2025 | U.S. Department of CommerceThe U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
Department of Commerce Announces CHIPS Incentives Award with Hemlock Semiconductor to Help Secure U.S. Production Capacity of Semiconductor-Grade Polysilicon
01/09/2025 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Hemlock Semiconductor (HSC) up to $325 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.
Biden-Harris Administration Announces Arizona State University Research Park as Planned Site for Third CHIPS for America R&D Flagship Facility
01/08/2025 | U.S. Department of CommerceThe Department of Commerce and Natcast announced the Arizona State University (ASU) Research Park in Tempe, Arizona as the anticipated location for the third flagship CHIPS for America research and development (R&D) facility.
Biden-Harris Administration Awards SRC $285M for New CHIPS Manufacturing USA Institute for Digital Twins
01/07/2025 | U.S. Department of CommerceThe U.S. Department of Commerce announced that CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a CHIPS Manufacturing USA institute headquartered in Durham, North Carolina.