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SMTA UHDI Symposium 2025, Part 2: State of the Art

01/29/2025 | Marcy LaRont, I-Connect007
A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.

SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions

01/28/2025 | Marcy LaRont, I-Connect007
SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.

ACCM Launches CeleritasSF & CeleritasBU for Ultra-High-Speed PCBs

01/27/2025 | PRNewswire
Advanced Chip and Circuit Materials Inc. (ACCM), a US-based manufacturer of skew free, ultra-thin copper-clad laminates and dielectric prepreg materials used to fabricate high layer count PTH, Buildup and UHDI multilayer printed circuit boards (PCBs), announced the introduction of the CeleritasSF and CeleritasBU series of laminates and prepregs, which enable PCIe Gen 6 & 7 and data rates of 224 Gb/s per channel.

Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology

01/23/2025 | John Watson -- Column: Elementary, Mr. Watson
This year introduces a new generational group, likely to be dubbed Generation Beta, since Generation Alpha was born between 2010 and 2024 and is considered the first generation born in the 21st century. Generation Alpha grew up in a world dominated by smartphones, artificial intelligence, and rapid technological advancements. It is anticipated that Generation Beta will live to see the 22nd century. 

AIM to Participate in SMTA Ultra High Density Interconnect Symposium

01/15/2025 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.
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