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American Standard Circuits’ Anaya Vardya to Keynote PanPac Summit 2025
January 9, 2025 | American Standard CircuitsEstimated reading time: 1 minute
The Pan Pacific Strategic Electronics Symposium (PanPac) has announced that Anaya Vardya, President and CEO of American Standard Circuits (ASC), will deliver the keynote address at this year’s conference. Hosted by the Surface Mount Technology Association (SMTA), PanPac 2025 will take place from January 27-30, 2025 at the Sheraton Maui Resort & Spa in Maui, Hawaii.
PanPac aims to foster relationships and build bridges across cultures, industries, technologies, companies, and individuals. The conference’s location in Hawaii is designed to create an atmosphere free from distractions, encouraging focused face-to-face interactions.
Mr. Vardya, a long-time industry innovator and leader, will deliver his keynote address on Tuesday, January 28. His presentation titled “Ultra High-Density Interconnects (UHDI): A Global Innovation in Electronics Assembly” will highlight American Standard’s groundbreaking work in UHDI printed circuit board (PCB) engineering and design. As the industry leader in UHDI technology, ASC continues to set new standards for innovation and excellence.
Check out these educational offerings from American Standard Circuits | ASC Sunstone:
- The Printed Circuit Designer's Guide to... DFM Essentials
- The Printed Circuit Designer’s Guide to... Fundamentals of RF/Microwave PCBs
- The Printed Circuit Designer’s Guide to... Flex and Rigid-Flex Fundamentals
- The Companion Guide to Flex and Rigid-Flex Fundamentals
- The Printed Circuit Designer’s Guide to… Thermal Management: A Fabricator's Perspective
- On the Line with...ASC Sunstone: Design for Manufacturing Podcast
Visit I-007eBooks.com to download these and other free titles.
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SMTA UHDI Symposium 2025, Part 2: State of the Art
01/29/2025 | Marcy LaRont, I-Connect007A group of about 50 attended the second annual SMTA Ultra High Density Interconnect Symposium on Jan. 23, 2025. After a morning of technical presentations on challenges and solutions regarding UHDI technology, we gathered for a delicious Mexican buffet lunch and some networking before reconvening for an afternoon of more technical topics.
SMTA UHDI Symposium 2025, Part 1: Challenges and Solutions
01/28/2025 | Marcy LaRont, I-Connect007SMTA hosted its second annual Ultra High Density Interconnect Symposium, a conference on cutting-edge PCB technology, on Jan. 23, 2025, at the Peoria Sports Complex in Arizona. A highly pro-business state with a special affection for the tech sector, Arizona is home to the biggest Intel semiconductor fab in the United States and the new TSMC chip fab. With an intimate group of approximately 50 attendees, the SMTA event offered a great forum for learning, interactive discussion, and networking.
ACCM Launches CeleritasSF & CeleritasBU for Ultra-High-Speed PCBs
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Elementary Mr. Watson: The Road Ahead—Advances in PCB Design Technology
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AIM to Participate in SMTA Ultra High Density Interconnect Symposium
01/15/2025 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry is pleased to announce its participation in the SMTA Ultra High Density Interconnect (UHDI) Symposium, taking place on January 23, 2025 at the Peoria Sports Complex in Peoria, Arizona.