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Altus Supplies Dual Lane Reflow Oven to Triple CEM’s Production Capacity

03/20/2025 | Altus Group
Altus Group, a leading distributor of capital equipment in the UK and Ireland, has partnered with Garner Osborne Circuits, a UK-based Contract Electronics Manufacturer, to install a Dual Lane Heller 1707 MK7 reflow oven.

Solderstar to Present Advanced Profiling Solutions at IPC APEX EXPO 2025

02/04/2025 | SolderStar
Solderstar, a leading provider of profiling solutions for the electronics manufacturing industry, will exhibit at IPC APEX EXPO 2025, which will take place March 18-20, 2025, at the Anaheim Convention Center in California.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.

Incap India Invests in New SMT Technology

01/24/2025 | Incap
Incap India has invested approximately EUR 1 million in a new SMT (surface-mount technology) production line at its third factory in Tumkur.

Indium to Feature Precision Au-Based Die-Attach Preforms at SPIE Photonics West

01/22/2025 | Indium Corporation
Indium Corporation will feature its high-reliability, Au-based precision die-attach preforms for critical laser and RF applications at SPIE Photonics West, Jan. 28-30, in San Francisco, California. SPIE West is the world’s premier event for lasers, biomedical optics, biophotonic technologies, quantum, and optoelectronics.
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