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Suggested Items

Indium to Showcase Power Electronics Products at NEPCON Japan

01/14/2025 | Indium Corporation
As one of the leading materials providers in the electronics assembly industry, Indium Corporation® is proud to feature its lineup of high-reliability products for power electronics at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.

SMT007 Magazine Explores Soldering Technologies—December 2024

12/02/2024 | I-Connect007 Editorial Team
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.

SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar

11/12/2024 | SMTA
The SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.

Bransys Acquires Two REHM VisionXP+ Nitro 3850 Reflow Ovens

10/14/2024 | Bransys
Bransys Group, a leading provider of comprehensive PCB design and assembly services, is pleased to announce the addition of two REHM VisionXP+ Nitro 3850 Type 834 reflow ovens to its state-of-the-art manufacturing facility.

Book Excerpt: The Printed Circuit Assembler’s Guide to... Low-Temperature Soldering, Vol. 2, Chapter 4

10/03/2024 |
Chapter 4 of this book addresses the challenges in ensuring high electrical reliability of low-temperature solder pastes in modern electronic assembly. Also covered is the need for new-generation materials due to advancements in technology. The authors also explore the impact of flux components on electrical reliability and the formulation considerations to achieve higher reliability.
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