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Trane Technologies Completes Acquisition of BrainBox AI
January 3, 2025 | BUSINESS WIREEstimated reading time: Less than a minute
Trane Technologies, a global climate innovator, announced that it has completed the acquisition of BrainBox AI, a pioneer in autonomous HVAC controls and generative Artificial Intelligence (AI) building technology. The acquisition was previously announced in a press release on December 18, 2024.
BrainBox AI uses advanced deep learning algorithms to predict building energy needs and automate HVAC systems, thus reducing energy consumption by up to 25% and reducing greenhouse gas (GHG) emissions by up to 40%. The acquisition builds on the companies’ existing collaboration and combines BrainBox AI’s leading Artificial Intelligence technology with Trane Technologies’ advanced building management and digital capabilities to meet fast-growing demand for sustainable, autonomous building solutions.
“We are delighted to officially welcome BrainBox AI associates as we further expand upon our companies’ complementary capabilities, technology and offerings,” said Riaz Raihan, senior vice president and Chief Digital Officer of Trane Technologies. “We look forward to bringing our teams and technologies closer together as we help customers meet their business and sustainability goals through the power of AI and smart building technologies.”
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Rocket Lab Onramped to Multi-Billion Dollar U.S. and U.K. Defense Contracts
04/15/2025 | BUSINESS WIRERocket Lab USA, Inc., a global leader in launch services and space systems, announced it has been selected to provide hypersonic test launch capability with its HASTE launch vehicle, engineering expertise, and other services through its participation in two multi-billion dollar government development programs for the United States and the United Kingdom.
STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint and Resize Global Cost Base
04/14/2025 | STMicroelectronicsSTMicroelectronics N.V., a global semiconductor leader serving customers across the spectrum of electronics applications, disclosed further elements of its program to reshape its global manufacturing footprint.
Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow
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Mycronic’s Global Technologies Acquires United Kingdom Based RoBAT
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IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging
04/09/2025 | Tracy Riggan, IPCThe IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.