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Rocket Lab Onramped to Multi-Billion Dollar U.S. and U.K. Defense Contracts

04/15/2025 | BUSINESS WIRE
Rocket Lab USA, Inc., a global leader in launch services and space systems, announced it has been selected to provide hypersonic test launch capability with its HASTE launch vehicle, engineering expertise, and other services through its participation in two multi-billion dollar government development programs for the United States and the United Kingdom.

STMicroelectronics Details Company-Wide Program to Reshape Manufacturing Footprint and Resize Global Cost Base

04/14/2025 | STMicroelectronics
STMicroelectronics N.V., a global semiconductor leader serving customers across the spectrum of electronics applications, disclosed further elements of its program to reshape its global manufacturing footprint.

Siemens Acquires DownStream Technologies to Expand PCB Design-to-Manufacturing Flow

04/08/2025 | Siemens
Siemens Digital Industries Software announced that it has completed the acquisition of DownStream Technologies, a leading provider of manufacturing data preparation solutions for printed circuit board (PCB) design.

Mycronic’s Global Technologies Acquires United Kingdom Based RoBAT

04/07/2025 | Mycronic
Mycronic’s Global Technologies division has acquired RoBAT, a company headquartered in the United Kingdom, which has developed a technology for fast and reliable tests of signal quality on PCBs.

IPC APEX EXPO Special Sessions: A Focus on Advanced Electronic Packaging

04/09/2025 | Tracy Riggan, IPC
The IPC Technology Solutions team hosted two special sessions on Thursday, March 20 at IPC APEX EXPO 2025 focused on advanced electronic packaging. The first session focused on AI/data center applications and the second on power electronics applications. The day kicked off with opening remarks on strategic direction of IPC in the area of advanced electronic packaging from Matt Kelly, IPC CTO, and an overview of the current landscape of component and system level packaging by Devan Iyer, PhD, IPC chief strategist, advanced packaging.
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