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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)

01/16/2025 | TopLine Corporation
TopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.

NAMICS Brings Innovative Thermoset Materials to PCB Fabrication

01/16/2025 | Andy Shaughnessy, Design007 Magazine
At PCB Carolina, Matt Lake and Ken Araujo of NAMICS Technologies spoke with Andy Shaughnessy about the introduction of an innovative thermoset material to PCB fabrication. This groundbreaking material, originally developed for the semiconductor packaging industry, addresses a longstanding demand for unreinforced thermoset films that enhance dielectric properties in PCB applications and allow for manufacturing the very finest of features, 0.002" and below.

Merlin Circuit Technology Achieves Prestigious JOSCAR Accreditation

01/14/2025 | Merlin Circuit Technology
Merlin Circuit Technology is proud to announce it has been awarded the coveted Joint Approvals Group for Industry (JAG) Standard 001 (JOSCAR) accreditation.

Global PCB Connections: The Future of HDI PCBs

01/16/2025 | Jerome Larez -- Column: Global PCB Connections
High-density interconnect (HDI) printed circuit boards (PCBs) transform modern electronics by providing increased functionality, reduced sizes, and enhanced performance in complex designs. They do so by using advanced techniques, such as finer line and space definitions, microvias, and additional board layers. Specialized via structures—namely blind, buried, and stacked vias—offer complex routing while conserving space. This allows for the development of highly compact electronic devices. This article delves into HDI PCB technology, the function and benefits of blind, buried, and stacked vias, and their impact on PCB performance and design.
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