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U.S. Army Awards Lockheed Martin Contract to Increase PAC-3 MSE Production Capacity
November 14, 2024 | Lockheed MartinEstimated reading time: 1 minute
The U.S. Army recently awarded Lockheed Martin a contract to support increasing production capacity to 650 Patriot Advanced Capability – 3 (PAC-3®) Missile Segment Enhancements (MSEs)per year. This is a vital step in significant efforts to meet the global demand for the world’s most advanced missile.
“Demand for PAC-3 MSE’s combat-proven deterrence capabilities continues to grow at a rapid pace,” said Brian Kubik, vice president of PAC-3 Programs at Lockheed Martin Missiles and Fire Control. “To meet the increased demand, Lockheed Martin started this effort with internal funding more than a year ago to expand the PAC-3 MSE production capacity, both in our factories and across the supply chain. We are also investing to implement lean, agile processes to deliver this critical product to our partners more efficiently.”
Over the last eight months, the PAC-3 team has significantly increased output and achieved new record highs for missile production. In 2024, production has grown by more than 30% with another 20% growth planned for next year.
Lockheed Martin is on track to produce in excess of stated capacity for the next several years.By the end of 2024, Lockheed Martin will have exceeded 500 PAC-3 MSEs, a new production high. The team also recently completed the 2,000th PAC-3 MSE missile– a significant milestone in the life of the program.
The production ramp up of critical systems like PAC-3 is a key component of Lockheed Martin’s 21st Century Security® vision which aims to strengthen the defense industrial base and develop more advanced, modernized solutions. As Lockheed Martin continues to ramp up production to meet demand, PAC-3 MSE remains at the forefront, addressing both current and emerging threats with unwavering precision and effectiveness.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/31/2025 | Nolan Johnson, I-Connect007Last week, the IMPACT conference took place in Taipei, bringing together advanced packaging experts from around the globe to share their knowledge. We’ll be bringing you post-conference coverage over the next few weeks, so look for that in our newsletters, and in the Advanced Electronic Packaging Digest. Other news seemed to have the U.S. at the center of the global discussions. My picks start in Phoenix, where TSMC, NVIDIA, and Amkor are all scrambling to establish new capabilities. There’s nothing like a strong demand signal to cause build-out, and AI chips are doing exactly that.