-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
SIA Commends Selections for CHIPS R&D Flagship Facilities
November 4, 2024 | SIAEstimated reading time: 1 minute
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the selections for the first two CHIPS for America National Semiconductor Technology Center (NSTC) facilities. The first facility will focus on extreme ultraviolet (EUV) lithography research and will be located within NY CREATES’s Albany NanoTech Complex in New York. The second facility (Sunnyvale, CA) will serve as an administrative headquarters for the NSTC and host the Design Enablement Gateway. Together, these programs will advance semiconductor design, research, workforce development, investment, and collaboration for the U.S. semiconductor industry.
“This week’s announcements mark exciting milestones in the implementation of the critical R&D programs enacted in the bipartisan CHIPS and Science Act. EUV lithography research is an investment in American leadership at the leading edge. And, the Albany facility will democratize access to this extraordinary tool and enable NSTC research to commence in the next year, driving the mission to propel American chip innovation from day one.
“Natcast’s site in Sunnyvale, CA will establish a new hub at the heart of Silicon Valley for the next generation of R&D in chip design, electronic design automation (EDA), chip and system architecture, and hardware security. Moreover, the facility will advance core NSTC programs, including the Workforce Center of Excellence—building our industry’s most essential asset: an innovative and skilled workforce. We congratulate the Department of Commerce and Natcast for initiating these impactful programs and applaud their diligent efforts to continue driving American leadership in chips.”
These resources will be available to NSTC members and researchers. Natcast has opened NSTC membership and urges semiconductor companies, universities, nonprofits and research institutions, national labs, and government agencies to take part in shaping the future of U.S. semiconductor R&D leadership.
Suggested Items
U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging
01/17/2025 | U.S. Department of CommerceThe U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.
Infineon Strengthens Supply Chain with New Backend Fab in Thailand
01/16/2025 | InfineonInfineon Technologies AG has broken ground for a new semiconductor backend production site in Samut Prakan, south of Bangkok, optimizing and further diversifying its manufacturing footprint. After an official meeting with the Prime Minister of Thailand, Paetongtarn Shinawatra, at the Government House, Infineon's Chief Operations Officer Dr. Rutger Wijburg launched the construction of the new fab today.
SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress
01/16/2025 | SIAThe Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.
U.S. Department of Commerce Announces Preliminary Terms with MACOM to Help Strengthen Supply Chain Resilience for U.S. Defense and Telecommunications Industries
01/16/2025 | U.S. Department of CommerceThe U.S. Department of Commerce signed a non-binding preliminary memorandum of terms (PMT) with MACOM Technology Solutions Inc. (MACOM) to provide up to $70 million in proposed direct funding under the CHIPS and Science Act.
SIA Statement on Biden Administration Action Imposing New Export Controls on AI Chips
01/15/2025 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden Administration’s decision to publish an interim final rule titled, “Export Control Framework for Artificial Intelligence Diffusion.”