Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

TI Honored by Volkswagen Group for Operational Excellence

07/16/2025 | Texas Instruments
Texas Instruments (TI) received the prestigious “Operational Excellence” award at the annual Volkswagen Group Award 2025 in Wolfsburg, Germany.

NXP Completes Acquisition of TTTech Auto to Accelerate the Transformation to Software-Defined Vehicles

06/21/2025 | NXP Semiconductor
NXP Semiconductors N.V. announced the completion of the acquisition of TTTech Auto , a leader in innovating unique safety-critical systems and middleware for software-defined vehicles (SDVs), pursuant to the terms of the previously announced agreement from January 2025.

Texas Instruments Plans to Invest Over $60 Billion to Manufacture Billions of Foundational Semiconductors in the U.S.

06/18/2025 | PRNewswire
Texas Instruments (TI) announced its plans to invest more than $60 billion across seven U.S. semiconductor fabs, making this the largest investment in foundational semiconductor manufacturing in U.S. history.

DRAM Revenue Drops 5.5% in the First Quarter of 2025; SK hynix Overtakes Samsung for Top Spot

06/03/2025 | TrendForce
TrendForce’s latest findings reveal that global revenue for the DRAM industry reached US$27.01 billion in 1Q25, marking a 5.5% QoQ decline. This downturn was driven by falling contract prices for conventional DRAM and a contraction in HBM shipment volumes.

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in