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Biden-Harris Administration Announces CHIPS Incentives Awards with BAE Systems, Rocket Lab

11/25/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce has finalized two separate awards under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The Department awarded BAE Systems Electronic Systems, a business unit of BAE Systems, Inc., up to $35.5 million in direct funding, and awarded Rocket Lab, the parent company of space power provider SolAero Technologies Corp., up to $23.9 million in direct funding. The Department will disburse the funds based on the companies’ completion of project milestones.

Indium Technical Expert to Present at SiP Conference China

11/25/2024 | Indium Corporation
Indium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.

Heilind Asia Pacific Awarded 2024 'Best Strategic Account Development' by TE Connectivity

11/25/2024 | GlobeNewswire
Heilind Asia Pacific is excited to share that it has received the 2024 Best Strategic Account Development Award from TE Connectivity, in recognition of the company's outstanding performance in driving business growth and strengthening strategic customer relationships.

VORAGO Technologies, Collabora Partner to Advance Open Source in Space

11/25/2024 | GlobeNewswire
VORAGO Technologies, a leading provider of radiation hardened and radiation tolerant MCUs and MPUs for Aerospace and Defense, and Collabora, a leader in open source software and support, announced they are partnering to advance the use of open source to achieve resilience for mission critical applications in space.

Aeluma Secures NASA Contract to Advance Quantum Dot Photonic Integrated Circuits for Aerospace and AI Applications

11/25/2024 | ACCESSWIRE
Aeluma, Inc., a semiconductor company specializing in high-performance, scalable technologies for mobile, automotive, AI, defense and aerospace, communication and quantum computing, announced it has been awarded a contract by NASA to develop quantum dot photonic integrated circuits (PICs) on silicon.
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