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U.S. Department of Commerce Announces $1.4 Billion in Final Awards to Support the Next Generation of U.S. Semiconductor Advanced Packaging

01/17/2025 | U.S. Department of Commerce
The U.S. Department of Commerce has announced that CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has finalized $1.4 billion in award funding to bolster U.S. leadership in advanced packaging and enable new technologies to be validated and transitioned at scale to U.S. manufacturing.

RIKEN Adopts Siemens' Emulation And High-Level Synthesis Platforms for Next-Generation AI Device Research

01/16/2025 | Siemens
Siemens Digital Industries Software announced today that RIKEN, a national research and development agency in Japan, is enhancing its research on next-generation AI devices with Siemens' comprehensive Veloce™

SIA Releases Policy Recommendations for Trump-Vance Administration and 119th Congress

01/16/2025 | SIA
The Semiconductor Industry Association (SIA) released a policy agenda setting forth the U.S. semiconductor industry’s policy priorities and suggested areas for collaboration with the Trump-Vance administration and the 119th Congress.

RTX's Raytheon Awarded $333M Contract for SM-6 Block IA Production

01/15/2025 | RTX
Raytheon, an business, was awarded a $333 million contract from the U.S. Navy to produce Standard Missile-6 (SM-6) Block IA missiles.

Argonne to Lead Two Microelectronics Research Projects Under U.S. Department of Energy Initiative

01/13/2025 | BUSINESS WIRE
The U.S. Department of Energy’s (DOE) Argonne National Laboratory is managing two microelectronics studies that will support multidisciplinary codesign of hardware and software and enable processing of vast quantities of data at unprecedented speeds.
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