The Knowledge Base: My 2025 Industry Wish List
Global Sourcing Spotlight: The Surprising World of Offshore B2B Industrial Values
Nolan’s Notes: Emerging Trends in 2025
Indium Corporation Expert to Present at High-Temperature Electronics Network Conference
June 18, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Technical Manager for Europe, Africa, and the Middle East Karthik Vijay will deliver a technical presentation at the International Conference and Exhibition on High-Temperature Electronics Network (HiTEN 2024), taking place July 15-17 in Edinburgh, Scotland, United Kingdom.
The presentation, Electrification & Power Modules – Innovative High-Reliability Solder Materials, will focus on interconnect solder materials designed to meet the more stringent requirements brought on by increased electrification in automotive and other power electronics applications.
“Mission profiles have become harsher with higher service temperatures, increased cycles, and lower Rth,” said Vijay. “Power module construction is also evolving. This means that the interconnect solder materials for substrate-attach, clip-attach, and module-attach will need to be designed for the newer requirements.”
Vijay heads the applications engineering team for customers in Europe, Africa, and the Middle East. His expertise is in automotive, industrial, and RF applications involving PCBA and power electronics, focusing on using different material sets, including solder preforms, solder paste, thermal interface materials, and semiconductor-grade electronics materials. He has more than 20 years of experience in electronics assembly and a master’s degree in industrial engineering with a specialization in electronics packaging and manufacturing from the State University of New York, Binghamton. He is a Certified SMT Process Engineer and earned his Six Sigma Green Belt certification from Dartmouth College’s Thayer School of Engineering. Vijay is active in several industry organizations, including IMAPS and SMTA, and has presented at several industry forums and conferences nationally and internationally.
Share on:
Suggested Items
PCB Market Expanding at 3.62% CAGR, To Reach $100 Billion by 2032
01/17/2025 | EINPresswire.comThe global Printed Circuit Board (PCB) Market was valued at US$72.63 billion in 2023 and is projected to exhibit steady growth over the coming years.
See You in Vienna: Speaker Spotlight on PEDC
01/16/2025 | I-Connect007 Editorial TeamVienna, Austria, is known for its amazing architecture, art museums, and classical music scene. But from now on, Vienna might also be known for its PCB design conference. IPC and FED have partnered to create a new PCB design conference in there. The Pan-European Electronics Design Conference (PEDC) takes place Jan. 29-30, 2025 at the NH Danube City hotel in Vienna.
DuPont Reaffirms Guidance, Accelerates Electronics Spin-off
01/16/2025 | PRNewswireDuPont announced the acceleration of the separation of its Electronics business and is now targeting November 1, 2025 to complete the transaction.
TRI to Join SMTA Austin Expo 2025
01/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Austin Expo 2025, scheduled to take place on February 6, 2025, at the Travis County Exposition Center.
TopLine’s Martin Hart to Present at Microelectronics Reliability and Qualification Workshop (MRQW)
01/16/2025 | TopLine CorporationTopLine Corporation’s Founder and CEO Martin Hart has been invited to deliver a presentation on the topic of how “Braided Solder Columns reduce mechanical stress in large heterogeneous 2.5D advanced packages for space and commercial applications” at The Aerospace Corporation’s Microelectronics Reliability and Qualification Workshop (MRQW) in Los Angeles (El Segundo), California on February 12, 2025.