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The Marketing Minute: Building Connections in the Electronics Industry

01/16/2025 | Brittany Martin -- Column: The Marketing Minute
Welcome to the first edition of The Marketing Minute. As someone deeply immersed in the electronics industry, I’ve seen how this field is not just about circuits and semiconductors; it’s about connections—between components, ideas, and people. Marketing in this niche requires the same principles: building authentic and powerful connections.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

01/10/2025 | Marcy LaRont, I-Connect007
In the past couple of weeks, we’ve had some big industry news. In the automotive world, Honda and Nissan merged to form the largest car manufacturer in Japan. Before President Biden left office, he made sure to distribute more CHIPS Act money to bring some measure of electronics manufacturing back to the U.S. And former President Jimmy Carter died at the age of 100 and was honored on Thursday, reminding us all what true integrity looks like. 

Marcy LaRont Named I-Connect007 Executive Director

01/08/2025 | IPC
Marcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 Magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

HaiLa Technologies Releases Extreme Low-Power Development Platform for Wi-Fi Communications

01/06/2025 | BUSINESS WIRE
HaiLa Technologies, a supplier of advanced low power wireless semiconductor solutions, introduced a new development platform to better support developers and researchers in creating extremely low power connected solutions.
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