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Deca Announces Agreement with IBM to Bring High-Density Fan-Out Interposer Production to North America

05/20/2025 | Deca Technologies
Deca Technologies announced the signing of an agreement with IBM to implement Deca’s M-Series™ and Adaptive Patterning® technologies in IBM’s advanced packaging facility in Bromont, Quebec.

StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA

05/07/2025 | StratEdge
StratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.

TRI at SMTA Wisconsin Expo 2025

04/24/2025 | TRI
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join the SMTA Wisconsin Expo 2025.

DuPont Ikonic 9000 CMP Pads Win 2025 Edison Award

04/09/2025 | DuPont
DuPont announced that its Ikonic™ 9000 series of polishing pads for chemical mechanical planarization (CMP) was awarded a 2025 Bronze Edison Award™ in the AI-driven advancements category.

Investment in High-Tech Manufacturing: Zollner Opens Cleanroom in Hungary

03/28/2025 | Zollner Elektronik AG
In a ceremonial event on March 13, 2025, representatives from ASML and Zollner inaugurated the new cleanroom at the Hungarian site in Vác. Among those present were Wayne Allan, Chief Strategic Sourcing & Procurement Officer, and Member of the Board of Management at ASML, Michiel Claessens.
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