Global Citizenship: Redefining Connection and Responsibility in Digital Transformation
The Marketing Minute: Strategic Short-form Content Builds Brand Momentum
SMT Perspectives and Prospects: Artificial Intelligence, Part 5: Brain, Mind, Intelligence
DELO: New Semicon Adhesive Propels Autonomous Driving Forward
October 20, 2023 | DELOEstimated reading time: 1 minute
DELO has developed a flexible electronics adhesive that permanently seals sensor housings airtight and thus reliably protects components such as image sensors. DELO DUALBOND BS3770 meets the stringent requirements of the semiconductor and automotive industries and helps drive innovation in autonomous driving.
The autonomous driving trend comes with ever-stricter safety requirements. Therefore, reliable components such as image sensors are installed in LiDAR and RADAR systems. Sensor housings on PCBs must be hermetically sealed throughout their entire service life in order to maintain their function permanently without interruption. However, previous solutions for hermetically sealing the housing and filter glass are reaching their limits due to these stricter requirements, failing to withstand the tests of the automotive industry, according to standard AEC-Q100.
DELO has developed DELO DUALBOND BS3770, a special electronics adhesive for semiconductor manufacturers to meet the demanding reliability and qualification tests of automotive suppliers.
Unlike adhesives previously available on the market, the newly developed adhesive is a flexible product with a Young's modulus of less than 5 MPa at room temperature. Due to its flexible properties starting from a temperature as low as approximately -50 °C, the adhesive can compensate for pressure changes that occur, such as those caused by temperature changes, humidity differences, or heat input in the reflow process during production. As a result, defects such as pop-ups or delamination do not occur, and the sensor is permanently protected.
DELO DUALBOND BS3770 can be precisely applied by needle dispensing while maintaining narrow and high bondlines. Curing takes place in two consecutive steps using UV light and heat. After dispensing, the adhesive is fixed in a few seconds by means of classic light fixation. Alternatively, it can be transferred to the B-stage, which is particularly relevant for bonding filter glasses with blackprint. At this stage, it achieves an initial adhesion comparable to tape. Afterwards, the second component can be joined. Thanks to the adhesive’s initial adhesion, the component is directly fixed so that it can be entirely processed further. Final curing takes place in a convection oven at +150 °C within 40 minutes.
In addition to image sensors for LiDAR and RADAR applications, DELO DUALBOND BS3770 is also used in driver monitoring and for 5G applications.
Share on:
Suggested Items
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
Europe Network Functions Virtualization: The Future of Telecom Infrastructure
04/16/2025 | Persistence Market ResearchNetwork Functions Virtualization (NFV) is rapidly transforming the telecommunications industry worldwide, and Europe is at the forefront of this digital transformation.
TDK Demonstrates the World's First ‘Spin Photo Detector’ Capable of 10X Data Transmission Speeds for the Next Generation of AI
04/16/2025 | PRNewswireThis new device is expected to be a key driver for implementing photoelectric conversion technology that boosts data transmission and data processing speed, particularly in AI applications, while simultaneously reducing power consumption.
The Test Connection, Inc. (TTCI) to Discuss Electronic Test & Manufacturing at the SMTA Capital Expo
04/15/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce its participation in the SMTA Capital Expo & Tech Forum on May 8, 2025, at the Waterford Springfield in Arlington, Virginia.
MVTec HALCON Version Includes Deep Learning-Based Technology for Robust Bin Picking
04/15/2025 | MVTecMVTec Software GmbH, a leading global manufacturer of machine vision software, is launching the new version of MVTec HALCON on May 27, 2025. Version 25.05 of the standard machine vision software includes numerous improvements as well as a new technology that combines deep learning algorithms with classic methods.