Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
Nolan’s Notes: Is Mexico the Pulse of Electronics in the Americas?
Standard of Excellence: Speed vs. Quality in Customer Service
Advanced Quality Control from Viscom at NEPCON Asia 2023 in Shenzhen
October 2, 2023 | Viscom AGEstimated reading time: 1 minute
Printed circuit board assemblies (PCBAs) and integrated circuits (ICs) are the focus of NEPCON Asia, which will be held October 11-13, 2023, in Shenzhen, China's southern hub of electronics innovation. Germany's Viscom AG will be represented by a select Asian team and four of its many advanced inspection systems: S3088 ultra chrome for 3D SPI, S3088 ultra chrome as a 3D AOI configuration, iX7059 PCB Inspection XL from Viscom's large 3D AXI portfolio, and the X8011-III 3D MXI system.
Viscom inspection systems can be integrated into location-independent, networked processes and provide new quality-relevant insights through the use of artificial intelligence and a variety of customized algorithms. All of this can be explored in detail at the Shenzhen World Exhibition & Convention Center (Baoan New Hall) at the Viscom booth No. 5D20. Solder paste inspection with an orthogonal optical resolution of 10 μm/pixel and a height resolution of 0.1 µm/pixel is combined with four angular views to deliver perfect, shadow-free inspection results. Automatic post-reflow optical inspection with the S3088 ultra chrome system even offers nine perspectives, true-to-life spatial renderings, and exceptionally high throughput in large production areas.
For inline X-ray, customers can choose from a well-designed Viscom product family, depending on their individual inspection needs. Whether for PCBAs with a length of up to 1600 mm or heavy assembled objects weighing up to 40 kg – the iX7059 series offers suitable configurations. For special tasks such as the inspection of IGBT modules with their ICs for power electronics applications, a 180 kV X-ray tube is available as a component. Different layers of the inspection object can be analyzed with highest precision.
Where speed is far less important than particularly brilliant resolution of X-ray results, the 3D-MXI Viscom System X8011-III comes into play. The thorough analysis of prototypes, the inspection of product complaints or the quality control of small batches are three of many examples of intelligent and effective use of its technological capabilities. Automatic reports and networked comparisons of the X8011-III’s X-ray images with inline results from other machines round out this special offering.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
11/05/2025 | Leo Lambert -- Column: Learning With LeoHigh density interconnect (HDI) technology has been a cornerstone of miniaturized electronics since Hewlett-Packard introduced the first chip-scale implementation in 1982. Over time, HDI processes became central to organic flip-chip packaging in the semiconductor industry. Today, the convergence of IC substrates and system-level PCBs has accelerated the adoption of UHDI.
Koh Young Technology Appoints Jeff Lee as Head of Industrial Solutions Business
11/03/2025 | Koh Young TechnologyKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, has appointed Jeff Lee as Head of Industrial Solutions Business.
UHDI Fundamentals: UHDI Technology and Automated Inspection
11/03/2025 | Anaya Vardya, American Standard CircuitsFollowing up on the last article on integrating ultra high density interconnect (UHDI) PCB technologies and Quality 5.0, here we will do a deeper dive into the automated inspection component. UHDI applications demand extreme precision, with line/space dimensions below 25 µm and microvias below 30 µm. Automated inspection systems are essential to achieving the defect-free fabrication required at these scales, and legacy automated inspection systems are becoming obsolete and ineffective.
Real Time with... SMTAI 2025: Koh Young's Innovations in SMT Inspection Technology
10/30/2025 | Real Time with...SMTAIJoel Scutchfield discusses his background as well as Koh Young's advancements in inspection technology. The conversation covers various inspection systems, including the flagship Zenith 2 system and recent software upgrades.
Koh Young Unveils Breakthrough Innovations at Productronica and SEMICON Europa 2025
10/28/2025 | Koh YoungKoh Young, the industry leader in True 3D measurement-based inspection and metrology solutions, will showcase a wave of innovations at Productronica and SEMICON Europa 2025, taking place November 18–21 at Messe München, Germany.