-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Intel, Mila Join Forces for Responsible AI
September 15, 2022 | IntelEstimated reading time: 4 minutes

Intel has announced a three-year strategic research and co-innovation collaboration with Mila, an artificial intelligence research institute based in Montreal. As part of this renewed commitment, more than 20 researchers across Intel and Mila will focus on developing advanced AI techniques to tackle global challenges such as climate change, new materials discovery and digital biology.
“In the face of current global challenges, we must push for a culture of open science between academia and industry to successfully advance AI applications for the benefit of society. We are thrilled to collaborate with Intel to rapidly explore novel and needed materials to improve carbon capture, accelerate drug discovery and enable a more sustainable future,” said Yoshua Bengio, founder and scientific director, Mila
Why It Matters: Accelerating the research and development of advanced AI to solve some of the world’s most critical and challenging issues requires a responsible approach to AI and the ability to scale computing technology. As leaders in computing and AI, and with alignment on being a positive, powerful agent of change in our world, Intel and Mila will be able to double down on projects started in 2021, add a third track and significantly increase the support to drive tangible results.
“Solving complex problems like climate change and new materials discovery requires deep AI research coupled with domain expertise and a commitment to advancing state-of-the-art computing technologies," said Kavitha Prasad, vice president and general manager of Datacenter, AI and Cloud Execution and Strategy at Intel. "Today’s announcement will play a critical role in surfacing key insights for researchers and driving forward the technological innovations. We look forward to teaming up with Mila to tackle the challenges we face today and create a better world for future generations with technology.”
About the Collaboration: This extended collaboration will focus on:
Automating AI-driven discovery of novel materials: Advances in chemical simulation techniques, like density-functional theory, have created methods capable of simulating important properties of complex material systems. These techniques, however, have been limited in the complexity of materials systems they can model given the unfavorable scaling of computational cost as the number of atoms increases. AI techniques, especially graph neural networks (GNNs), help approximate chemical simulations with significantly lower computational cost, particularly as the system size increases. This holds tremendous promise in using AI-enabled simulated techniques to replicate materials systems of greater complexity. The potential discovery of novel materials could contribute to cost and carbon footprint reductions.
Intel and Mila will collaborate on developing scientific and technological innovations to improve the performance of GNNs on atomistic simulations, like the Open Catalyst dataset. These efforts can potentially democratize researchers’ ability to engage with atomistic material data by enhancing the related technology pipeline. The research teams will work on creating learning-based frameworks to search effectively within the vast search spaces found in materials design applications. These frameworks can draw upon ideas from reinforcement learning, search algorithms, generative models, as well as other machine learning algorithms including generative flow networks pioneered by Mila.
Applying causal machine learning for climate science: While standard physics-based climate models can help predict the effects of climate change, they are complex and computationally expensive. They often take months to run – even on specialized supercomputing hardware – which reduces the frequency of simulation runs and the ability to provide granular, localized predictions. Furthermore, these models are typically unable to explain the reasoning or causal relationships underlying their predictions. Intel and Mila aim to fill this gap by building a new type of climate model emulator based on causal machine learning to identify which variables are predictive among high-dimensional inputs to traditional climate models. The project seeks to enable significant advancements in climate science and directly inform policy by enabling thorough and trustworthy predictions of the effects of climate change.
Accelerating the study of molecular drivers of diseases and drug discovery: Drug discovery is a lengthy process that on average costs $2.6 billion per approved drug. The cost is high because finding a small molecule that binds to a particular target is a perilous and highly uncertain process that can take more than a decade. Additionally, even when a molecule is found, there’s a possibility that it may fail in later stages.
Intel and Mila researchers will work together to identify better drug candidate molecules more quickly and more simply. For example, predicting complex phenotypes, including diseases based on the genotype of single-nucleotide polymorphisms (SNPs), has been a long-standing challenge in digital biology because most phenotypes are affected by many SNPs across the genome. The main computational challenge is jointly learning the causal effects of all the SNPs in the genome on the phenotypes, using large-scale population data. The exact solution has a search space of size exponential to the number of SNPs. With millions of SNPs detected, the exact solution is computationally intractable. However, with the availability of high-resolution data, the advent of breakthroughs in AI, and growth in compute density driven by Moore’s Law, Intel and Mila plan to develop AI techniques to:
Understand the molecular drivers behind diseases, predicting complex phenotypes including diseases based on the genotype of SNPs.
Identify the most promising drug molecules. The new AI techniques implemented by Intel and Mila aspire to significantly reduce this cost and bring transformative drugs to market sooner.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
Is Glass Finally Coming of Age?
10/13/2025 | Nolan Johnson, I-Connect007Substrates, by definition, form the base of all electronic devices. Whether discussing silicon wafers for semiconductors, glass-and-epoxy materials in printed circuits, or the base of choice for interposers, all these materials function as substrates. While other substrates have come and gone, silicon and FR-4 have remained the de facto standards for the industry.
Creative Materials to Showcase Innovative Functional Inks for Medical Devices at COMPAMED 2025
10/09/2025 | Creative Materials, Inc.Creative Materials, a leading manufacturer of high-performance functional inks and coatings, is pleased to announce its participation in COMPAMED 2025, taking place November 17–20 in Düsseldorf, Germany.
Jiva Leading the Charge Toward Sustainable Innovation
09/30/2025 | Marcy LaRont, PCB007 MagazineEnvironmental sustainability in business—product circularity—is a high priority these days. “Circularity,” the term meant to replace “recycling,” in its simplest definition, describes a full circle life for electronic products and all their elements. The result is re-use or a near-complete reintroduction of the base materials back into the supply chain, leaving very little left for waste. For what cannot be reused productively, the ultimate hope is to have better, less harmful means of disposal and/or materials that can seamlessly and harmlessly decompose and integrate back into the natural environment. That is where Jiva and Soluboard come in.
Space Forge Inc. and United Semiconductors LLC Partner to Develop the Supply Chain for Space-grown Semiconductor Materials
09/29/2025 | Space Forge Inc.Space Forge Inc., the advanced materials company revolutionizing semiconductor manufacturing in space, has announced the signing of a strategic Memorandum of Understanding (MoU) with United Semiconductors LLC, a leading specialist in bulk crystal growth of III-V semiconductor compounds. The agreement formalizes the ongoing collaborative efforts that started over a year ago, marking a significant step forward in strengthening the partnership between the two companies.